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Tuesday, May 24, 2016
VOLUME -26 NUMBER 5
Publication Date: 05/1/2011
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Components and Distribution
Product Preview: EDS
May 2011 Issue
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Photo Stencil's New NicAlloy-XT Technology
Colorado Springs, CO — A new stencil technology for printing solder paste on PCBs, called NicAlloy-XT
, is bridging the gap between traditional laser cut stencils and higher-end electroformed stencils. The specific stencil technology required for a printing application depends on many variables such as smallest pitch to be printed, the mix of components being placed on the board, and the area ratio calculation of the smallest component. The hierarchy starts with laser cut and reaches electroformed stencils, which are used for very fine pitch SMT — 16 mil (0.4mm) pitch QFP, QFN, and µBGAs) and wafer bump applications. The print defect rate decreases as printing performance increases. Ideally, the goal is to have a stencil aperture with straight side walls and a smooth mirror-like finish to promote greater solder paste release. More rigorous printing requirements, due to high mix and finer pitch components, lead to a natural hierarchy of stencil technologies. Miniaturization is driving challenges for capital equipment and stencil companies and there's been a product gap from traditional laser cut to electroforming. The NicAlloy-XT technology uses a new proprietary coating process called NiPlate
that combines a laser cut product with a NiPlate coating.
Contact: Photo Stencil, 4725 Centennial Blvd., Colorado Springs, CO 80919
719-599-4305 fax: 719-599-4334 Web:
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Contact Us: 610-783-6100 | email@example.com
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