Tuesday, May 22, 2018
VOLUME -26 NUMBER 5
Publication Date: 05/1/2011
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Archive >  May 2011 Issue >  Front Page News > 
Giving UAVs High Power, Wide Bandwidth


In the late 1950s, the U.S. Air Force began planning critical missions for reconnaissance without putting military personnel in the line of fire. That marked the beginning of the era of unmanned aerial vehicles (UAVs). Today, the Air Force has a fleet of 250 UAVs, with USAF Chief of ...
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IPC Back to Schaumburg, ATE to McCormick


Chicago, IL — In a move that is sure to cause confusion, disharmony, cancellations, and undue cost overruns, Canon Communications has decided to move its multi-headed Midwest extravaganza from Rosemont's Stephens Convention Center to Chicago's McCormick Place for the September 2011 event. This ...Read More
NIST: Smart Grid Standard Gets Closer

Gaithersburg, MD — Is a "smart" electric grid finally going to become a reality? It's beginning to look that way, since the governing board of the public-private Smart Grid Interoperability Panel (SGIP) has voted in favor of a new standard and a set of guidelines — standards that have been much needed and ...Read More


 
 
SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.         
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        
Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018
BERLIN, GERMANY - Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two presentations and a booth, highlighting its latest solutions for flexible electronics as well as fan-out wafer-level and fan-out panel-level packaging.    
 
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