Friday, October 28, 2016
Publication Date: 04/1/2011
Archive >  April 2011 Issue >  Product Preview: APEX > 

Flying Probers and Laser Soldering from Seica
Double-side flying probe test system.
Salem, NH — Seica, Inc. is showing production systems that include the Pilot M4 Flying Prober and the Firefly Laser Selective Soldering system. In addition, the company's original Quick Test software has been selected for the Innovative Technology Center, as well as for a poster presentation.

The Pilot M4 is a full performance, double-sided, flying probe system. Its high level of flexibility makes it appropriate for companies with a wide variety of testing needs. The prober's vertical architecture has two flying probes on each side of the UUT, two additional openfix probes, and two cameras. The system's configuration allows for true in-circuit testing, giving full access even to boards that do not have all the test points on one side. The combination of test tools and techniques, in a single program, maximizes test coverage and throughput: FNODE signature analysis of the UUT on the nets; PWMON net analysis for power on the boards; vectorless tests (JSCAN and OPENFIX), to test ICs for opens and shorts; analog and digital in-circuit test; Optional Quick Test; Optional functional and visual test capabilities and NETLIST learning procedure used to rebuild layouts and electrical schematics of boards when the relative technical documentation is incomplete or unavailable Optional Thermal Scan resources to aid in troubleshooting boards in depot repair.

Quick Test is an innovative software that allows Pilot users to write and execute functional tests quickly. Users are able to correctly program all the system resources, without knowledge of the internal architecture or specific programming language of the ATE. Also on display, the Firefly Selective Soldering system uses a laser-based technology that is completely automated. The Firefly has been designed to optimize flexibility and automation, including solutions for specific requirements, such as an external pre-heating unit. The system is available in three configurations: top soldering, bottom soldering, and top and bottom soldering. The ability to apply all of the energy to a single point makes this technology applicable in situations where it is not possible to heat the whole board or where there are problems generated by reduced accessibility. An added benefit: the user is able to change from lead to lead-free solder by simply changing the spool of solder wire. The clean soldering process eliminates the costs and logistics involved with cleaning boards and handling residual waste.

Contact: Seica, Inc., 50A Northwestern Drive, Suite 10, Salem, NH 03079 603-890-6002 fax: 603-890-6002 Web:

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