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New Fujipoly Self-Adhesive Cooling Patch
Self-adhesive thermal patch on component.
Carteret, NJ — A new thermal material breakthrough from Fujipoly allows engineers to reduce chip and circuit temperature by as much as 11 percent without the need for a heatsink.
The advanced 4-ply, peel-n-stick FPDSEM 90 Cooling Patch offers the fastest and easiest way to radiate heat from an electronic component to the surrounding environment. All that's needed is to apply the patch like a sticker to the surface of any "hot spot". The material can also be custom cut or trimmed to fit virtually any shape. The low resistance Cooling Patch provides a thermal conductivity of 1.5 W/m°K and a thermal emissivity of 0.97. The FPDSEM 90 product is 25mm thick and can be ordered in sheets, rolls or kiss-cut rolls depending on the application.
Contact: Fujipoly America Corporation, P.O. Box 119, Carteret, NJ 07008
732-969-0100 fax: 732-969-3311 E-mail: firstname.lastname@example.org Web:
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