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Wednesday, September 28, 2016
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Electronic Mfg. Products
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Buehler Bundles Simplify Ordering Consumables
Materials "bundle" simplify testing.
Lake Bluff, IL — To simplify ordering and purchasing, Buehler has created its new Sum-Met
Bundles, which contain all the grinding and polishing consumables required to prepare 100 specimens. Using one part number and one price, laboratory, medical, quality control, university and other material analysis and preparation facilities can order the bundles for five different application categories: Fe and Ni (ferrous and nickel-based alloys such as Inconel
); Al and Cu (aluminum and copper based alloys); Ti (titanium alloys); Electronic and Polymer (especially components such as wiring boards); and Ceramic and Refractory (non-metallic materials common in high-heat applications).
Typical Bundle contents include a combination of CarbiMet2
grinding discs (in 8-, 10- or 12-inch diameter), polishing pads/cloths, MetaDi
diamond suspensions or pastes and MasterMet
final polishing suspensions. To support repeatability and consistency, the bundles enable users to follow the step-by-step best practices established in the company's free publication: "Sum-Met Guide to Materials Preparation".
Contact Buehler, 41 Waukegan Road, Lake Bluff, IL 60044
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