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VOLUME -26 NUMBER 2
Publication Date: 02/1/2011
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Electronic Mfg. Services
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Special Features: Components and Distribution
Product Preview: Electronics West / MDM
February 2011 Issue
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SMTA International Conference on Soldering and Reliability
Minneapolis, MN — The SMTA Technical Committee invites industry professionals to attend the 2011 International Conference on Soldering and Reliability being held this May 4-6, 2011 in Toronto, Ontario, Canada.
Following on the very successful 2005 and 2006 International Conferences on Lead-free Soldering, and the SMTA International Conference on Soldering and Reliability held in Toronto, Ontario, Canada since 2007, this conference brings together a community of soldering and reliability experts.
Suggested topics to be covered include:
Lead-free Assembly and Test
Package on Package
High Density Interconnects
Thermal Interface Materials
Die Attach Soldering & L-F Challenges
The conference is sponsored by the SMTA Toronto Chapter.
Contact: Patti Hvidhyld
952-920-7682 E-mail: email@example.com Web:
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