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VOLUME -26 NUMBER 2
Publication Date: 02/1/2011
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Lord Intros Thermal Potting Compound
Thermally conductive silicone encapsulant.
Cary, NC — Lord Corporation has introduced a new thermally conductive silicone encapsulant. Designed for applications where high heat dissipation is required, the encapsulant, called SC-305 is a two-component silicone system that is especially suited for LED lighting power supply encapsulation. The product can be room temperature or heat cured for maximum adhesion. Benefits include low stress, high thermal conductivity and superior environmental resistance.
Composed of an addition-curing polymer that will not depolymerize when heated in confined spaces, the silicone encapsulant is a durable solution. It also meets the requirements of UL 94 V-O, providing excellent flame retardancy. According to the company, the three-step application process — involving mixing, applying and curing — is user-friendly, making the product an excellent choice for encapsulation.
The company states that the product was developed to meet the needs of customers who require a high-performance thermally conductive encapsulant at a cost that allows them to be competitive in their respective industries.
Contact Lord Corp., 111 Lord Dr., Cary, NC 27511
919-469-2500 Web:
http://www.lord.com
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