Saturday, December 3, 2016
VOLUME -26 NUMBER 2
Publication Date: 02/1/2011
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Archive >  February 2011 Issue >  Product Preview: Electronics West / MDM > 

SelectConnect Metallizes 3D MIDs
3D molded interconnect chassis.
Palatine, IL — SelectConnect Technologies utilizes a patented SelectConnect process to selectively plate injection molded parts with copper and nickel to create three-dimensional connections with multiple points of contact for a 3D Molded Interconnect Device (MID).

When medical device maker Insulet sought to improve the

functionality of its OmniPod® Insulin Management System, it partnered with Phillips Plastics Corporation to create an optimally performing internal plastic chassis component. Insulet then chose SelectConnect Technologies to provide the metallization, an integral step in completing the 3D Molded Interconnect Device (MID). According to SelectConnect, its metallization process is unique in that it allows control of the metal deposition process to produce fine electronic traces with high resolution and yield. Once the molded parts have been received, the company builds electroless copper, electroless nickel, and immersion gold traces on the structured patterns to form the circuit path. The company's process allows the circuitry to be incorporated directly onto the plastic component, permitting miniaturization, parts consolidation, reduced assembly time, and cost reduction.

For the chassis development described, the company used 250 micro-in. (6.25µ) of electroless copper for a good conductive path throughout the part. A thin layer of 50 micro-in. (1.25µ) of nickel was then added on top of the copper to create a barrier layer that prevented the copper from oxidizing before the entire assembly was pressfit into a circuit board.

In addition to providing metallization for two-shot molded MIDs, the company also does Laser Direct Structuring (LDS) of one-shot injection molded components. The component is molded from a commercially available doped thermoplastic, laser traced to write the circuit-layout onto the component, and then metallized with copper, nickel and gold. The LDS process is suitable for transferring circuit artwork directly onto three-dimensional components.

Contact: SelectConnect Technologies, 600 S. Vermont St., Palatine, IL 60067-6950 847-359-1490 Web:
http://www.selectconnecttech.com


 
 
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