Saturday, May 26, 2018
VOLUME -26 NUMBER 2
Publication Date: 02/1/2011
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Archive >  February 2011 Issue >  Front Page News > 
Extending Moore's Law with Epitaxial Graphene


Move over silicon. There's a new electronic material in town, and it goes fast. That material, the focus of the 2010 Nobel Prize in physics, is graphene — a fancy name for extremely thin layers of ordinary carbon atoms arranged in a "chicken-wire" lattice. These layers, sometimes, just a single atom thick, conduct electricity with virtually no resistance, very little heat generation — and less power consumption than silicon.

With silicon device fabrication approaching its physical limits, many researchers believe graphene can provide a new platform material that would allow the semiconductor industry to continue the march ...
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IEEE Cites Potential for Spin-Based Technology

Piscataway, NJ — According to research reported in the special issue update of Proceedings of the IEEE ( http://www.ieee.org/proceedings) on Nanoelectronics ...Read More
NEMA Publishes New Magnet Wire Standard

Rosslyn, VA — The National Electrical Manufacturers Association (NEMA) has published ANSI/NEMA MW 1000-2008 Revision 2-2010 Magnet Wire. MW 1000, produced by NEMA's Magnet Wire Section, is the premier standards publication for general requirements, product specifications, and test procedures for magnet wire ...Read More


 
 
Indium Corporation to Feature AuSn Solder Preforms at International Microwave Symposium
CLINTON, NY - Indium Corporation will feature its precision AuSn solder preforms at International Microwave Symposium (IMS) 2018 from June 10-15 in Philadelphia, Penn.

Indium Corporation’s AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing.         

SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.         
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        
 
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