Sunday, December 4, 2016
VOLUME -26 NUMBER 2
Publication Date: 02/1/2011
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Archive >  February 2011 Issue >  Front Page News > 
Extending Moore's Law with Epitaxial Graphene


Move over silicon. There's a new electronic material in town, and it goes fast. That material, the focus of the 2010 Nobel Prize in physics, is graphene — a fancy name for extremely thin layers of ordinary carbon atoms arranged in a "chicken-wire" lattice. These layers, sometimes, just a single atom thick, conduct electricity with virtually no resistance, very little heat generation — and less power consumption than silicon.

With silicon device fabrication approaching its physical limits, many researchers believe graphene can provide a new platform material that would allow the semiconductor industry to continue the march ...
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IEEE Cites Potential for Spin-Based Technology

Piscataway, NJ — According to research reported in the special issue update of Proceedings of the IEEE ( http://www.ieee.org/proceedings) on Nanoelectronics ...Read More
NEMA Publishes New Magnet Wire Standard

Rosslyn, VA — The National Electrical Manufacturers Association (NEMA) has published ANSI/NEMA MW 1000-2008 Revision 2-2010 Magnet Wire. MW 1000, produced by NEMA's Magnet Wire Section, is the premier standards publication for general requirements, product specifications, and test procedures for magnet wire ...Read More


 
 
Murphy, Choh and Pilla Join ClassOne Technology's Board of Advisors
KALISPELL, MT - ClassOne Technology (www.classone.com), manufacturer of advanced wet processing equipment for ≤200mm substrates announced the formation of a Board of Advisors. This body will be made up of highly-regarded senior executives from the semiconductor industry who will provide their perspective and guidance to ClassOne as it navigates the expansion of its operations.
 

Indium Corporation’s Karch Recognized for Best Presentation at IMAPS Autumn Conference 2016
CLINTON, NY - Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, was recognized for his technical presentation at the IMAPS Autumn Conference in October in Munich, Germany.

Karch was awarded “Best Presentation” for the session New Solder Material Technology in the Manufacturing Process of IGBT Modules, which discussed a new method that produces strong, reliable solder joints that resist cracking and thermal fatigue.

Ventec International Group Focus On High Thermal Performance Materials for Automotive and LED Applications at HKPCA 2016, China
SUZHOU, CHINA - Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, will exhibit in Booth #4B16 at HKPCA, China, scheduled to take place December 7th-9th, 2016 at the Shenzhen Convention & Exhibition Center, China.

 
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