Thursday, April 19, 2018
VOLUME -26 NUMBER 2
Publication Date: 02/1/2011
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Archive >  February 2011 Issue >  Front Page News > 
Extending Moore's Law with Epitaxial Graphene


Move over silicon. There's a new electronic material in town, and it goes fast. That material, the focus of the 2010 Nobel Prize in physics, is graphene — a fancy name for extremely thin layers of ordinary carbon atoms arranged in a "chicken-wire" lattice. These layers, sometimes, just a single atom thick, conduct electricity with virtually no resistance, very little heat generation — and less power consumption than silicon.

With silicon device fabrication approaching its physical limits, many researchers believe graphene can provide a new platform material that would allow the semiconductor industry to continue the march ...
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IEEE Cites Potential for Spin-Based Technology

Piscataway, NJ — According to research reported in the special issue update of Proceedings of the IEEE ( http://www.ieee.org/proceedings) on Nanoelectronics ...Read More
NEMA Publishes New Magnet Wire Standard

Rosslyn, VA — The National Electrical Manufacturers Association (NEMA) has published ANSI/NEMA MW 1000-2008 Revision 2-2010 Magnet Wire. MW 1000, produced by NEMA's Magnet Wire Section, is the premier standards publication for general requirements, product specifications, and test procedures for magnet wire ...Read More


 
 
EOS WLC550 series offers maximum Cooling Flexibility on Standard Footprint
Last week at the MT-CONNECT in Nuremberg more than 150 companies from the European MedTec Business met for discussing the latest trends and guidelines in MedTec industry. When EOS power presented its medical up to class-2 powersupplies at MT-CONNECT, the EOS team made an exciting observation: While everyone is still talking about the size of the powersupplies, which is still very true for home devices, the real crucial factor for sales support for larger devices at the MT connect was the cooling.   
SMTA Europe announces Session 6 Technical Program on Automotive Electronics at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Eden Prairie, MN - Electronic products may be subjected to thermal excursions resulting from the power on/off cycling and changes in the environment temperature. The board geometry and architecture can affect the thermal-mechanical reliability of the PCB materials. Dr. Eric Cotts from Binghamton University will present on PCB Materials and Fabrication. Dr. Cotts will share his thoughts on designing for excellence.
SEMI and TechSearch International Report Global Semiconductor Packaging Materials Market Reaches $16.7 Billion

MILPITAS, CA SEMI, the industry association representing the global electronics manufacturing supply chain, and TechSearch International today reported that the global semiconductor packaging materials market reached $16.7 billion in 2017. While slower growth of smartphones and personal computers – the industry’s traditional drivers – is reducing material consumption, the slowdown was offset by strong unit growth in the cryptocurrency market in 2017 and early 2018. Flip chip package shipments into the cryptocurrency market, while providing a windfall to many suppliers, are not expected to remain at high levels.  


C&K ANNOUNCES THAT IT HAS ACQUIRED VUILLERMOZ
Newton, MA – C&K, one of the world’s most trusted brands of high-quality electromechanical switches, today announces that it has acquired the company Vuillermoz, a micro-mechanical components and tooling company located in St. Claude, France.



 
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