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VOLUME -25 NUMBER 12
Publication Date: 12/1/2010
Front Page News
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Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Test and Measure
Product Preview: electronica
December 2010 Issue
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IMAPS Device Packaging Conference in Scottsdale
Washington, DC — The seventh Annual Device Packaging Conference (DPC2011) will be held at the Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, AZ, on March 7-10, 2011. It is an international event sponsored and organized by the International Microelectronics And Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, sales and marketing.
The 2011 conference will feature technical sessions, panel discussions, a poster session, professional development courses and a vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 5 topical workshop areas related to microelectronic packaging: 3D IC & Packaging; Flip Chip Technologies; MEMS & Associated Microsystems; Wafer Level Packaging; and Emerging Technologies (LEDs & Passive Integration).
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue has an ideal atmosphere to showcase products and services to key decision-making professionals in the industry. Full 8 by 10-ft. exhibit spaces will be available. The Exhibit Hall for this event has sold out each year since 2006. Device Packaging Professional Development Courses (PDCs) are scheduled for those wishing to broaden their knowledge of device packaging — providing a selection of half-day courses offered on Monday, March 7th, preceding the technical conference.
Contact: IMAPS, 611 2nd St. N.E., Washington, DC 20002
202-548-4001 fax: 202-548-6115 Web:
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