Sunday, December 17, 2017
VOLUME -25 NUMBER 12
Publication Date: 12/1/2010
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Archive >  December 2010 Issue >  Front Page News > 
Fuel Cell Cars Shine in Shanghai

Shanghai, China — The recently closed 2010 Shanghai World EXPO, which ran from May 1 through Oct. 31, covered a vast area of 5km2 (1.3mi.2) — a lot of ground to cover on foot, so EXPO management provided a comprehensive people-moving system. Described as the largest world's fair ...
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Optimism Seen for Small Manufacturing Sector

Rockford, IL — A leading manufacturing sector economist sees "beginning stages for some optimism" in the small business community which, in turn, indicate "solid" economic news for many U.S. manufacturers in 2011.Read More
Converting Near-IR Single Photons

Gaithersburg, MD — Researchers at the National Institute of Standards and Technology (NIST) have demonstrated for the first time the conversion of near-infrared 1,300nm wavelength single photons emitted from a true quantum source, a semiconductor quantum dot, to a near-visible wavelength of 710nm. The ability ...Read More


 
 
SEMI: North American Semiconductor Equipment Industry Posts November 2017 Billings
MILPITAS, CA - North America-based manufacturers of semiconductor equipment posted $2.05 billion in billings worldwide in November 2017 (three-month average basis), according to the November Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. 
Avnet Sponsors The Not Impossible Awards Recognizing Emerging Technologies that Improve Lives
Avnet, a leading global technology distributor, today announced its title sponsorship of The Not Impossible Awards, which recognizes the breakthrough achievements of innovators who share the Not Impossible Labs mission to create inventive technology that improves the well-being of others. 
aveniĀ® S.A. Extends Copper Interconnects to 5nm and Below for BEOL Integration Using Innovative Electroplating Chemistry
MASSY, France - aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, today announced it has obtained results that strongly support the continued use of copper in the back end of line (BEOL) for advanced interconnects, at and beyond the 5nm technology node. 
Kilopass NVM OTP IP Achieves 3-Lot Qualification on GLOBALFOUNDRIES 14nm LPP (Low Power Process) Process Technology
SAN JOSE, CA - Kilopass Technology Inc., a leading provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), today announced that it successfully achieved a three-lot qualification on GLOBALFOUNDRIES (GF) 14nm LPP (Low Power Process) technology platform for its one-time programmable (OTP) NVM technology. 
 
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