Thursday, May 24, 2018
VOLUME -25 NUMBER 12
Publication Date: 12/1/2010
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Archive >  December 2010 Issue >  Front Page News > 
Fuel Cell Cars Shine in Shanghai

Shanghai, China — The recently closed 2010 Shanghai World EXPO, which ran from May 1 through Oct. 31, covered a vast area of 5km2 (1.3mi.2) — a lot of ground to cover on foot, so EXPO management provided a comprehensive people-moving system. Described as the largest world's fair ...
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Optimism Seen for Small Manufacturing Sector

Rockford, IL — A leading manufacturing sector economist sees "beginning stages for some optimism" in the small business community which, in turn, indicate "solid" economic news for many U.S. manufacturers in 2011.Read More
Converting Near-IR Single Photons

Gaithersburg, MD — Researchers at the National Institute of Standards and Technology (NIST) have demonstrated for the first time the conversion of near-infrared 1,300nm wavelength single photons emitted from a true quantum source, a semiconductor quantum dot, to a near-visible wavelength of 710nm. The ability ...Read More


 
 
Indium Corporation Expert to Present at PCIM Europe
CLINTON, NY - Indium Corporation expert, Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will present at PCIM Europe on Wednesday, June 6, in Nuremberg, Germany.

Vijay will present Improve Reliability and Bondline Control with InFORMS® and Indalloy®276.
 

SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.         
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        
Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018
BERLIN, GERMANY - Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two presentations and a booth, highlighting its latest solutions for flexible electronics as well as fan-out wafer-level and fan-out panel-level packaging.    
 
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