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Yamaichi: Connector for Tool-free Field Assembly
Publication Date: 10/21/2010

Munich, Germany — The expense of wiring up and plugging in the modules of a photovoltaic system comprises between 10 to 20 percent of the entire cost of each unit. Reducing these costs can be achieved, for instance, by using preassembled cables.
 
Often,it is only possible on-site to determine the length of a cable and install a connector in the field. Such installation thus ...
Next Gen Aircraft Connector from Tyco
Publication Date: 10/21/2010

Harrisburg, PA — Tyco Electronics has launched the ARINC 600 next-generation receptacle connector — an innovative re-engineering of a classic solution to meet the needs of today's commercial, aerospace, and military applications.
Thermo Fisher: New Alloy Analyzers
Publication Date: 10/21/2010

Billerica, MA — Thermo Fisher Scientific Inc. is showing the newest members of its family of Thermo Scientific Niton handheld XRF analyzers, the new Niton® XL2 GOLDD Series and the enhanced Niton XL3t GOLDD+ Series. The instruments of choice in nondestructive elemental analysis solutions for ...
Seica Intros New Test Systems
Publication Date: 10/21/2010

Strambino, Italy — Seica is showing the renewed Pilot ATE flying probe platform and the new generation in-circuit and functional test systems of the Compact Line.
 
Pilot is described as the most versatile and complete line of automated flying probe test systems on the market today, offering the widest range of ...
Rochester Electronics Gets Altera Legacy ICs
Publication Date: 10/21/2010

Newburyport, MA — Rochester Electronics has been selected as an authorized distributor of Altera Corporation's legacy and end-of-life (EOL) field programmable gate array (FPGA) devices. Rochester has acquired finished devices as well as wafer/die, intellectual property, test programs, and test equipment ...
Radiall Intros Kit for Wireless Stations
Publication Date: 10/21/2010

Chandler, AZ — Radiall USA, Inc. is introducing its new R2CT connection kit, which provides a waterproof, sealed connection for fiber-to-the-antenna (FTTA), remote radio head equipment, and similar outdoor applications where a protected interface is needed. The field-installable kit provides low ...
PVA: Gear Pump Meter-Mix Dispensing System
Publication Date: 10/21/2010

Cohoes, NY — PVA's MX4000 Gear Pump Meter-Mix Dispensing System is a robust system designed to control non-abrasive meter-mix dispensing applications such as; potting and encapsulation, conformal coating, form in place gasketing, laminating, sealing, and adhesive/assembly operations. Used in automotive ...
Omron: Proven PCB Inspection Solutions
Publication Date: 10/21/2010

Schaumburg, IL — Omron is presenting its comprehensive line of AOI and AXI inspection equipment from table-top to in-line systems that provide a total SMT solution fully compatible with the QupNavi Software suite designed for Root-Cause Analysis and total SMT quality improvement.
OmniVision Launches High-End VGA Camera
Publication Date: 10/21/2010

Santa Clara, CA — OmniVision Technologies, Inc. has introduced the OV7727, a top-of-the-line VGA sensor for the high-end ultra-thin notebook market. The 1/13-in. (1.95mm) OV7727 is the first VGA sensor built with OmniBSI backside illumination technology. It combines extremely strong performance ...
Nordson DAGE: Highly Advanced X-ray Inspection System
Publication Date: 10/21/2010

Aylesbury, Buckinghamshire, UK — Nordson DAGE is showing off its XD7600NT100HP X-ray inspection system which the company claims is the most technologically advanced X-ray inspection system on the market today with groundbreaking 100 nanometer (0.1µ) feature recognition for finite analysis of the ...
High Freq. MEMS Oscillator from IQD
Publication Date: 10/21/2010

Palo Alto, CA — IQD is introducing a newly developed high frequency MEMS oscillator. The new IQMS-900 series MEMS oscillator is available in an exceptionally wide frequency range from 1MHz up to 800MHz. The new model can be factory programmed with either a LVDS (low voltage differential source) or ...
JTAG Technologies: New Product Family
Publication Date: 10/21/2010

Eindhoven, Netherlands — The JTAG Live product family has been designed to help clients to solve their hardware debug problems quickly and painlessly — the tool to have on site when engineers need to locate faults in their prototypes.
Ironwood: Test & Burn-In Socket
Publication Date: 10/21/2010

Burnsville, MN — Ironwood Electronics has introduced a new QFN Socket, the SBT-QFN-4008, addressing high performance requirements for 0.4mm pitch devices. The contactor is a stamped spring pin with 34 gram actuation force per pin and cycle life of 100,000 insertions.
Hypertherm Releases 2 New Plasma Torch Systems
Publication Date: 10/21/2010

Hanover, NH — Hypertherm has released the Powermax65® and Powermax85®: two new plasma cutting systems that come with more torch options, technological innovations, and a more rugged torch design for greater durability in harsh cutting environments.
HSI Sensing Improves Steel Sensors
Publication Date: 10/21/2010

Chickasha, OK — HSI Sensing (formerly Hermetic Switch, Inc.) has introduced new and improved steel sensing proximity sensors, the 11000 Series.
 
Through its product development process, HSI Sensing updated ...
Heraeus Releases New Silver Paste
Publication Date: 10/21/2010

West Conshohocken, PA — Heraeus has released SOL9383, a silver solder paste especially formulated and designed to make excellent contact on P+ surface of N-Type Cells.
Goepel: In-System Emulation Technology
Publication Date: 10/21/2010

Jena, Germany — Goepel electronic has developed a dedicated model library for processors with ARM11® architecture that supports the innovative emulation technology VarioTAP®.
ERSA: Economically Priced Reflow Systems
Publication Date: 10/21/2010

Wertheim, Germany — Newest members of the ERSA HOTFLOW family, the HOTFLOW 3/14e and 3/20e are designed to deliver exceptional soldering results because of superior thermal performance, low transverse profile and excellent zone separation.
Enthone Intros Highly Conductive PWB Final Finish
Publication Date: 10/21/2010

West Haven, CT — Enthone Inc., a business of Cookson Electronics, has introduced ENTEK® OM. The patented, Organic Metal® process delivers a visible, highly conductive PWB final finish that offers both ease of inspection and in-circuit testing (ICT). The need to paste test points during board assembly is ...
Digitaltest Flying Prober Uses Boundary Scan
Publication Date: 10/21/2010

Stutensee, Germany — Digitaltest has integrated JTAG Boundary Scan into the MTS500 Condor flying probe tester, which in addition to traditional ICT test routines, is also capable of performing functional tests. Tests of prototype boards and small batches are streamlined and cost-effective.
 
 
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