Wednesday, July 27, 2016
VOLUME -25 NUMBER 10
Publication Date: 10/1/2010
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ARCHIVE >  October 2010 Issue >  Front Page News > 
U. of Texas & SPEA Open Test Lab on Campus

Tyler, TX — A new test and instructional center at the University of Texas in Tyler is being made possible by an endowment from Italian test equipment maker SPEA, which has its US headquarters here. The University of Texas at Tyler College of Engineering and Computer Science has received an endowment ...

Sandia Green Computer in Top 10

Albuquerque, NM — Red Sky/Red Mesa, listed by Top500 Supercomputer Sites as the 10th fastest computer in the world, has been selected as one of the 15 winners of Oracle's Enable the Eco-Enterprise award.
Worldwide IC Packaging Market

Sacramento, CA — The semiconductor industry has been cyclical since its inception, but the general trend for the industry is upwards. The newly released report, "The Worldwide IC Packaging Market, 2010 Edition", offers an in-depth look at the worldwide integrated circuit (IC) packaging market.


 
 
Registration Open with New Exhibition Features at SEMICON Europa
GRENOBLE, FRANCE - Today SEMI announced registration opened for Europe’s largest electronics manufacturing exhibition, SEMICON Europa (25-26 October) in Grenoble. Featuring over 100 hours of technical sessions and presentations, SEMICON Europa includes semiconductor equipment and materials as well as additional topics, such as Imaging, Power Electronics, and Advanced Packaging.
SMTA and IPC: Cleaning and Conformal Coating Conference Program Finalized
MINNEAPOLIS, MN - The SMTA and IPC are pleased to announce the program for the 2016 Cleaning and Conformal Coating Conference being held October 25-27, 2016 in Rosemont, IL.

Two tutorials will be held on Tuesday, October 25th. Dale Lee, Plexus Corporation, will instruct “Design for Excellence: Focus on DfR-Design for Reliability of Hardware to be Cleaned” on Tuesday morning. After lunch, Doug Pauls, Rockwell Collins and Jason Keeping, P.Eng., Celestica, Inc. will co-instruct a course on “Robust Coating Processes in the Factory: Methods, Critical Parameters, Problems and Remedies.”

Viribright Lighting Announces US Patent Award for LED Packaging Design
CORONA, CA - Viribright Lighting, Inc., a global leader in LED lighting manufacturing, announced today that is has received a US Patent (US 9,379,300) for the design of an LED chip welded in a flip-chip manner on a floating copper heat radiation support. The Viribright LED packaging design generates more lumens per watt with better control of heat dissipation than previous LED manufacturing methods.

 
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