Sunday, December 17, 2017
VOLUME -25 NUMBER 10
Publication Date: 10/1/2010
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Archive >  October 2010 Issue >  Front Page News > 
U. of Texas & SPEA Open Test Lab on Campus

Tyler, TX — A new test and instructional center at the University of Texas in Tyler is being made possible by an endowment from Italian test equipment maker SPEA, which has its US headquarters here. The University of Texas at Tyler College of Engineering and Computer Science has received an endowment ...
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Sandia Green Computer in Top 10

Albuquerque, NM — Red Sky/Red Mesa, listed by Top500 Supercomputer Sites as the 10th fastest computer in the world, has been selected as one of the 15 winners of Oracle's Enable the Eco-Enterprise award.Read More
Worldwide IC Packaging Market

Sacramento, CA — The semiconductor industry has been cyclical since its inception, but the general trend for the industry is upwards. The newly released report, "The Worldwide IC Packaging Market, 2010 Edition", offers an in-depth look at the worldwide integrated circuit (IC) packaging market.Read More


 
 
SEMI: North American Semiconductor Equipment Industry Posts November 2017 Billings
MILPITAS, CA - North America-based manufacturers of semiconductor equipment posted $2.05 billion in billings worldwide in November 2017 (three-month average basis), according to the November Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. 
Avnet Sponsors The Not Impossible Awards Recognizing Emerging Technologies that Improve Lives
Avnet, a leading global technology distributor, today announced its title sponsorship of The Not Impossible Awards, which recognizes the breakthrough achievements of innovators who share the Not Impossible Labs mission to create inventive technology that improves the well-being of others. 
aveniĀ® S.A. Extends Copper Interconnects to 5nm and Below for BEOL Integration Using Innovative Electroplating Chemistry
MASSY, France - aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, today announced it has obtained results that strongly support the continued use of copper in the back end of line (BEOL) for advanced interconnects, at and beyond the 5nm technology node. 
Kilopass NVM OTP IP Achieves 3-Lot Qualification on GLOBALFOUNDRIES 14nm LPP (Low Power Process) Process Technology
SAN JOSE, CA - Kilopass Technology Inc., a leading provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), today announced that it successfully achieved a three-lot qualification on GLOBALFOUNDRIES (GF) 14nm LPP (Low Power Process) technology platform for its one-time programmable (OTP) NVM technology. 
 
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