Saturday, May 26, 2018
VOLUME -25 NUMBER 10
Publication Date: 10/1/2010
Advertisements

Archive >  October 2010 Issue >  Front Page News > 
U. of Texas & SPEA Open Test Lab on Campus

Tyler, TX — A new test and instructional center at the University of Texas in Tyler is being made possible by an endowment from Italian test equipment maker SPEA, which has its US headquarters here. The University of Texas at Tyler College of Engineering and Computer Science has received an endowment ...
Read More
Sandia Green Computer in Top 10

Albuquerque, NM — Red Sky/Red Mesa, listed by Top500 Supercomputer Sites as the 10th fastest computer in the world, has been selected as one of the 15 winners of Oracle's Enable the Eco-Enterprise award.Read More
Worldwide IC Packaging Market

Sacramento, CA — The semiconductor industry has been cyclical since its inception, but the general trend for the industry is upwards. The newly released report, "The Worldwide IC Packaging Market, 2010 Edition", offers an in-depth look at the worldwide integrated circuit (IC) packaging market.Read More


 
 
Indium Corporation to Feature AuSn Solder Preforms at International Microwave Symposium
CLINTON, NY - Indium Corporation will feature its precision AuSn solder preforms at International Microwave Symposium (IMS) 2018 from June 10-15 in Philadelphia, Penn.

Indium Corporation’s AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing.         

SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.         
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        
 
search login