Monday, December 5, 2016
VOLUME -25 NUMBER 10
Publication Date: 10/1/2010
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Archive >  October 2010 Issue >  Front Page News > 
U. of Texas & SPEA Open Test Lab on Campus

Tyler, TX — A new test and instructional center at the University of Texas in Tyler is being made possible by an endowment from Italian test equipment maker SPEA, which has its US headquarters here. The University of Texas at Tyler College of Engineering and Computer Science has received an endowment ...
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Sandia Green Computer in Top 10

Albuquerque, NM — Red Sky/Red Mesa, listed by Top500 Supercomputer Sites as the 10th fastest computer in the world, has been selected as one of the 15 winners of Oracle's Enable the Eco-Enterprise award.Read More
Worldwide IC Packaging Market

Sacramento, CA — The semiconductor industry has been cyclical since its inception, but the general trend for the industry is upwards. The newly released report, "The Worldwide IC Packaging Market, 2010 Edition", offers an in-depth look at the worldwide integrated circuit (IC) packaging market.Read More


 
 
Murphy, Choh and Pilla Join ClassOne Technology's Board of Advisors
KALISPELL, MT - ClassOne Technology (www.classone.com), manufacturer of advanced wet processing equipment for ≤200mm substrates announced the formation of a Board of Advisors. This body will be made up of highly-regarded senior executives from the semiconductor industry who will provide their perspective and guidance to ClassOne as it navigates the expansion of its operations.
 

Indium Corporation’s Karch Recognized for Best Presentation at IMAPS Autumn Conference 2016
CLINTON, NY - Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, was recognized for his technical presentation at the IMAPS Autumn Conference in October in Munich, Germany.

Karch was awarded “Best Presentation” for the session New Solder Material Technology in the Manufacturing Process of IGBT Modules, which discussed a new method that produces strong, reliable solder joints that resist cracking and thermal fatigue.

Ventec International Group Focus On High Thermal Performance Materials for Automotive and LED Applications at HKPCA 2016, China
SUZHOU, CHINA - Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, will exhibit in Booth #4B16 at HKPCA, China, scheduled to take place December 7th-9th, 2016 at the Shenzhen Convention & Exhibition Center, China.

 
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