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Friday, February 24, 2017
VOLUME -25 NUMBER 9
Publication Date: 09/1/2010
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: PCB and Assembly
Product Preview: AATE/IPC Midwest
September 2010 Issue
Front Page News
Solar Energy Powers Remote African School
Lashaine, Northern Tanzania — It's an ongoing project, bringing the benefits of today's technology to a school in this remote village. The prime movers behind it are Engineers Without Borders Portland Professionals Chapter (EWB), and they traveled to Lashaine Village, Tanzania in June to oversee
the expansion of a rainwater harvesting system and the installation of an expanded solar energy system at Orkeeswa Secondary School. The school
Where the IC Market Is Going
By Sandra Winkler, New Venture Research
Nevada City, CA — The semiconductor industry took a beating in early 2009, but bounced back sooner than many other industries — actually ending in better shape than had been anticipated at the beginning of the year; people do love their gadgets. Small, handheld devices which keep us connected ...
Newton & Einstein Move Over; New Test for Gravity Proposed
Gaithersburg, MD — A new experiment proposed by physicists at the National Institute of Standards and Technology (NIST) may allow researchers to test the effects of gravity with unprecedented precision at very short distances — a scale at which exotic new details of gravity's behavior may be detectable. ...
Dr. Nebioglu of Dymax Corporation Presented Her Research at the IPC/ APEX Expo
TORRINGTON, CT - Dymax Corporation is proud of the participation of its Senior R&D Manager of the Adhesives team, Dr. Aysegul Kascatan Nebioglu at the IPC/ APEX Expo 2017 that took place on February 14 to 17 in San Diego, California.
Indium Corporation’s Durham to Share Expertise at IMAPS Device Packaging
CLINTON, NY - Indium Corporation’s
, Technical Support Engineer for Semiconductor and Advanced Assembly Materials, will share her expertise at IMAPS
13th International Conference and Exhibition on Device Packaging
on March 7-9 in Fountain Hills, Ariz.
3D Glass Solutions Announces Highest Efficiency 5G IPD RF Filters
ALBUQUERQUE, N.M. - 3D Glass Solutions, Inc. (3DGS), a world-class expert on the fabrication of electronic packages and devices using photo-definable glass-ceramics, announced today the development and production of the highest efficiency 5G integrated passive devices (IPD) for radio frequency (RF) filters. These RF filters have been designed to operate as bandpass filters for frequencies at 5GHz and 28GHz with less than 1.0 dB of insertion loss.
Internet of Things: a promising future for sensors| Yole Développement & Fraunhofer EMFT seminar - Munich, July 3&4
LYON, FRANCE - The MEMS & sensor offering has never been so diverse. Inertial, pressure, temperature, (bio-)chemical and gas sensors as well as microphones, fingerprint and iris recognition. All devices are part of the IoT revolution.
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