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Wednesday, May 25, 2016
VOLUME -25 NUMBER 8
Publication Date: 08/1/2010
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Special Features: Test and Measurement
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August 2010 Issue
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Lord Corp. Intros Thermal Adhesive
Thermally conductive adhesive.
Cary, NC — Lord Corporation has introduced a new low-modulus, high-thermal conductivity adhesive called MT-815. Created in response to a market need for a more flexible, high thermal conductivity adhesive, the new compound can be used in a variety of applications including a thermal adhesive for large die, in die-attach applications, or as a solder replacement.
The first in the company's series of new low modulus, thermally conductive adhesives, the material has a modulus of <1GPa, allowing it to be more flexible and therefore less likely to crack or delaminate under the stresses of temperature cycles. It has also been formulated to achieve thermal conductivity of >10 W/m-K, creating a new class of flexible adhesives with high thermal conductivity.
According to the company, the new material builds on a long tradition of innovation in thermal management materials, including Gelease
thermal conductive gels, as well as high performance thermal conductivity adhesives like MT-315 and TC-501 no pump-out grease.
Contact: Lord Corp., 111 Lord Dr., Cary, NC 27511
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