Save. Share. Connect.
Monday, February 19, 2018
VOLUME -25 NUMBER 8
Publication Date: 08/1/2010
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Test and Measurement
Product Preview: AATE/IPC Midwest
August 2010 Issue
Add Message Board
Lord Corp. Intros Thermal Adhesive
Thermally conductive adhesive.
Cary, NC — Lord Corporation has introduced a new low-modulus, high-thermal conductivity adhesive called MT-815. Created in response to a market need for a more flexible, high thermal conductivity adhesive, the new compound can be used in a variety of applications including a thermal adhesive for large die, in die-attach applications, or as a solder replacement.
The first in the company's series of new low modulus, thermally conductive adhesives, the material has a modulus of <1GPa, allowing it to be more flexible and therefore less likely to crack or delaminate under the stresses of temperature cycles. It has also been formulated to achieve thermal conductivity of >10 W/m-K, creating a new class of flexible adhesives with high thermal conductivity.
According to the company, the new material builds on a long tradition of innovation in thermal management materials, including Gelease
thermal conductive gels, as well as high performance thermal conductivity adhesives like MT-315 and TC-501 no pump-out grease.
Contact: Lord Corp., 111 Lord Dr., Cary, NC 27511
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | email@example.com
powered by GIM