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Thursday, February 23, 2017
VOLUME -25 NUMBER 8
Publication Date: 08/1/2010
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Test and Measurement
Product Preview: AATE/IPC Midwest
August 2010 Issue
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Advanced Interconnections Offers Test & Debug Socket
Test and burnin socket.
West Warwick, RI — The new Mod5 Series Flip-Top BGA Socket from Advanced Interconnections Corp. is designed for test, debug, and validation of 0.50mm pitch BGA devices. The compact, surface mount design requires no tooling or mounting holes in the target PC board, maximizing real estate while reducing board costs.
The new Series' socket design provides a compact, surface mount test solution for µBGA chipsets used in applications such as handheld, mobile, and wireless product development. Precision machined spring probes with industry proven solder balls ensure high reliability performance.
The socket accommodates BGA packages up to 12mm sq. (22 x 22 rows), with larger sizes available upon request. It incorporates precision machined spring probes that offer high bandwidth with very low insertion loss; Compact size of 20 x 27mm (0.787 x 1.063-in.) enables use on design boards with small keepout zone.
The Flip-Top BGA Socket's easy actuation with simple cover and turn-screw heat sink enables quick insertion and extraction; SMT design lowers test board costs by allowing use of alternative pad plating (vs. gold) and eliminating the need for expensive hardware and mounting holes which interfere with PCB traces. Modular design enables simple reflow process, similar to BGA device; and metallic probes offer proven reliability over elastomeric sockets and long-life (spring probe contact system life is 200,000 cycles minimum).
Contact: Advanced Interconnections Corp., 5 Energy Way, West Warwick, RI 02893
800-424-9850 or 401-823-5200 fax: 401-823-8723E-mail: email@example.com Web:
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