Save. Share. Connect.
Tuesday, October 25, 2016
VOLUME -25 NUMBER 8
Publication Date: 08/1/2010
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Test and Measurement
Product Preview: AATE/IPC Midwest
August 2010 Issue
Electronic Mfg. Products
Add Message Board
Nikon: Confocal Metrology for Demanding Applications
Conformal metrology system.
Brighton, MI — Nikon Metrology, Inc. has introduced the new Confocal NEXIV-K6555 with advanced confocal metrology capabilities to provide new measurement possibilities for demanding applications. Developed on the strength of the company's optical and mechanical technologies, the mew instrument incorporates the latest Confocal, image processing and Through the Lens (TTL) laser technologies for faster and more accurate non-contact 3D measurements on larger size substrates, probe cards and other applications requiring large stage travel.
The company designed the new system with longer XY travel (650 x 550mm) (25.6 x 21.7-in.) to cover the non-contact 3D measurement requirements of larger substrates, such as recent cutting-edge interposer substrates and probe cards with greater accuracy and faster measurement speed. In addition, the newly developed ZC objective lenses for height measurement can obtain height data for every pixel in the field of view in a single scan, allowing fast, accurate, repeatable and reproducible wide-area height measurements. For faster measurement speed, the company has redesigned the standard confocal optics using lower magnifications such as 3x and 7.5x. The system can be configured either with built-in high magnification CF optical head or with built-in standard magnification CF optical head so that it can be optimized for broad variations of complicated and smaller measuring targets. It is particularly well-suited for micro-bumps on advanced IC packages, probe cards, substrate pattern height and size, advanced glass and polymer components such as micro lenses and contact lenses, laser marks on semiconductor wafers, MEMS, wire bonding and advanced fine interconnection technology.
The new instrument also allows for both 2D measurements on brightfield images with the CNC 15x zooming optics and 3D measurements on confocal images. Furthermore, the TTL scanning laser auto focus and video image auto focus functionalities add greater flexibility.
Contact: Nikon Metrology, Inc., 12701 Grand River, Brighton, MI 48116
810-220-4360 E-mail: Marketing_US@NikonMetrology.com Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | email@example.com
powered by GIM