Monday, December 5, 2016
Publication Date: 05/1/2009
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DEK: Enclosed Print Head Technology
Publication Date: 7/8/2010

Rolling Meadows, IL — DEK's ProFlow® ATx enclosed print head's inherent benefits include exceptionally efficient materials transfer, superior throughput rates, high process yields, low material wastage and improved process control. By containing in a sealed environment, as opposed to being exposed ...
New Test Sockets from Emulation Technology
Publication Date: 7/8/2010

Camarillo, CA — Emulation Technology, Inc., is introducing the ET3300 Series of elastomeric test sockets. These versatile products have interchangeable alignment plates that significantly reduce costs by eliminating the need to purchase a dedicated socket for every IC package size being tested. The ...
Heidenhain: Absolute Linear Encoder
Publication Date: 7/8/2010

Schaumburg, IL — Incorporating absolute technology in a multi-substrate scale tape linear encoder design, Heidenhain is offering the versatile LIC 4000. Besides its capability of making absolute position measurements, this encoder is characterized by its high resolution of 1 nanometer and its fast ...
Henkel Intros Electrically Conductive Adhesive
Publication Date: 7/8/2010

Irvine, CA — Henkel has developed Hysol ECCOBOND CA3556HF, a silver-filled electrically conductive adhesive designed to offer fast cure at low temperature. The material is especially suitable for high-throughput production processes and applications that dictate high peel strength, such as the assembly ...
Ironwood: New Burn-In Contact Solution
Publication Date: 7/8/2010

Burnsville, MN — Ironwood Electronics is offering a new contact solution for engineering, burn-in and test applications. The company's recently released XBT product line utilizes a unique contact technology at an extremely low cost. XBT contact technology incorporates a three-part system which includes ...
Nikon Metrology: Handheld Scanning Solution
Publication Date: 7/8/2010

Brighton, MI — Nikon Metrology has introduced the new MCA II range of articulated arms with a measurement volume between 1.8 and 3.6 meter diameter. Equipped with the brand new ModelMaker MMDx, the MCA II is a cutting-edge and accurate handheld scanning combination that handles every inspection task regardless of specimen size, material and location ...
Nordson DAGE Launches Multi-Purpose Bondtester
Publication Date: 7/8/2010

Aylesbury, Buckinghamshire, UK — Nordson DAGE is introducing the 4000Plus multi-purpose bondtester. According to the company, the new tester delivers exceptional data integrity and superior accuracy. The system is able to perform a wide range of shear and pull applications as well as new push functionality ...
Omega: Mini RFID Data Loggers and Readers
Publication Date: 7/8/2010

Stamford, CT — Omega's new CE-compliant OM-80 series of data loggers and readers are economical, accurate and provide a reliable solution for cold chain environmental monitoring. The OM-84 model has a miniature weather-resistant design with a factory replaceable battery.
Palomar Launches 3rd Gen Laser Calibrator
Publication Date: 7/8/2010

Carlsbad, CA — Palomar Technologies has introduced its 3rd generation Laser Interferometer Model 2100C. The new instrument is a tool used for measuring ultrasonic transducer excursion (or peak amplitude) by measuring micro inches of motion. This tool was first conceived to calibrate the company's ...
Low Cost Plasma Etching System from Plasma Etch
Publication Date: 7/8/2010

Carson City, NV — Plasma Etch, Inc. has introduced a highly affordable benchtop plasma cleaning system, the PE-50, designed specifically for Universities and R&D facilities.
 The PE-50 plasma cleaning system utilizes a substantial 6 x 6 x 4-in. Aluminum vacuum chamber for accommodating substrates up to 5 x 5-in. with...
Renishaw: New Lathe Inspection Touch Probes
Publication Date: 7/8/2010

Hoffman Estates, IL — Renishaw's new RLP40 and OLP40 lathe inspection probes offer a choice of signal transmission technologies — radio or optical — to make part set-up and inspection on turning centers accurate, simple and reliable. Measuring just 40mm (1.57-in.) in diameter and 58.3mm (2 ...
Sonoscan: Bonded Wafer Inspection Technology
Publication Date: 7/8/2010

Elk Grove Village, IL — As part of its bonded wafer inspection technology, Sonoscan has recently demonstrated acoustic imaging of defects in the seal that surrounds and protects the cavities in MEMS devices. Such defects most frequently take the form of voids within the seal, which may be direct ...
Electrostatic Chuck Supply from Trek
Publication Date: 7/8/2010

Medina, NY — Trek Model 645 is a software-driven amplifier (supply) for electrostatic wafer chucking (E-chucks). Various chucking/de-chucking profiles can be designed and uploaded to the Model 645 to optimize performance in an e-chuck process/facility.
Yamaichi Intros Filtered RJ-45 Jack
Publication Date: 7/8/2010

Munich, Germany — Yamaichi's Y-ConJack-31 is a new RJ-45 connector jack for PCB with integrated magnetic filter, and LED light pipes for the function display. The jack is particularly suited for industrial applications such as industrial Ethernet.
MVP: All-in-One Configurable AOI System
Publication Date: 7/8/2010

Carlsbad, CA — Machine Vision Products is demonstrating the Ultra 850G Semiconductor, Packaging and MicroElectronics AOI solution — the latest addition to the company's line of Automated Optical Inspection tools. The system is configurable to be deployed in all aspects of the packaging, die or ...
RASIRC: Controlled Steam for Semicon Processing
Publication Date: 7/8/2010

San Diego, CA — RASIRC® is presenting data detailing how ultrapure water vapor can enhance thin film integrity in ALD, MOCVD, and sputtering processes. The poster, Water Vapor Delivery for CIGSe and Other Thin Film Vacuum Processes, highlights a method for control and delivery of water vapor that excludes ...
SPEA: Comprehensive Test Automation
Publication Date: 7/8/2010

Volpiano, Italy — SPEA is presenting its comprehensive range of test equipment and automation for the production testing of power semiconductors, based on its Comptest MX test architecture. This is reportedly the only architecture that meets all the test requirements of power semiconductors. All ...
SEC: Hugle Sora Cleaning System
Publication Date: 7/8/2010

Moorpark, CA — Semiconductor Equipment Corporation of Moorpark, California has become the official U.S. distributor for Hugle Electronics UPC-12500 FOUP Cleaning System. Hugle Electronics Inc. is now manufacturing a variety of semiconductor box cleaning systems for 300mm wafer manufacturing lines ...
Thermocouple Exhaust Gas Temp.Sensor from Watlow
Publication Date: 7/8/2010

St. Louis, MO — Watlow®, a designer and manufacturer of electric heaters, controllers and temperature sensors, is introducing the EXACTSENSE thermocouple for high temperature exhaust gas temperature sensing. The device combines the durability and high temperature capability of a thermocouple ...
Asahi Now Making MPV Manifold Valves in the U.S.
Publication Date: 7/8/2010

Malden, MA — Asahi/America, Inc. is now manufacturing Dymatrix MPV PTFE multiport manifold valves at the company's Malden, Mass. manufacturing/distribution facility. The expansion of the company's facility greatly reduces domestic lead times to two to four weeks. The custom PTFE valve bodies ...
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