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Monday, August 21, 2017
VOLUME -25 NUMBER 7
Publication Date: 07/1/2010
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Assembly and Packaging
Product Preview: Semicon West
July 2010 Issue
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StratEdge Intros SMT Packages
San Diego, CA — StratEdge is introducing a new family of fully hermetic, low-profile, leadless surface mount (SMT) packages with improved electrical performance. The SM family of packages fits aerospace, avionics, automotive, and telecom industry applications and is especially suited for LEDs, MEMS, and optical devices.
These new packages incorporate a metal plug in the base that allows a direct ground path for enhanced electrical performance. Anticipated performance is DC to 30+GHz. The first package offered has a 5 x 5mm outer dimension and 28 I/Os. There are plans for other configurations including packages with 4 x 4, 6 x 6, and 8 x 8mm outer dimensions. All SM packages meet stringent MIL-STD requirements for hermeticity. Additions to the SM Family will be offered as standard products, with samples and volume production quantities available in Q3 of this year.
The SM packages match industry-standard outlines enabling them to be used as direct replacements for traditional quad flat package designs. They can be used in place of plastic over-molded packages in applications where an air cavity is desired. The air cavity provides improved microwave performance, allows for ease of rework and repair, and is suitable for prototyping. In addition, air cavities are often necessary for sensors and other devices that need to respond to movement.
Contact: StratEdge, 6335 Ferris Square, Suite C, San Diego, CA 92121
866-424-4962 fax: E-mail: email@example.com Web:
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