Wednesday, August 24, 2016
VOLUME -25 NUMBER 7
Publication Date: 07/1/2010
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ARCHIVE >  July 2010 Issue >  Special Features: Assembly and Packaging > 
Heavy Wire Bonding: Exceeding Productivity Demands


How can you keep up with these demands for your heavy wire bonding production? If your manufacturing equipment is not on ? or perhaps more importantly ? above par, it may be time to take a look at the latest heavy wire bonding manufacturing equipment innovations.
Material Trade-offs for Advanced Electronic Packages


In the electronics industry's headlong rush to shrink everything, everything is smaller, even though the components and circuits are far more complex than ever. The overall trend has been an increase in functionality and a decrease in size. Improvements in radar and communications technology ...
Manufacturing Solar Cells — Assembly & Packaging


The trend in packaging has shown a serious shift: attendance at assembly and packaging conferences has been dwindling over the past few years. At the same time, solar power shows have been celebrated with lots of fanfare, aisles crowded. More and more electronics assembly and packaging ...
How SMT Equipment Slashes Back-End Semicon Costs


The electrical connections between a semiconductor die and its package — and hence the outside world — are today made using wire (or flip-chip) bonders. Because of the repeatability accuracy needed for this operation — down to 10µ — the machines are expensive and have ...
Mitigating Tin Whisker Risks


The electronics industry has had concerns about tin whiskers for at least 60 years — often discussed in frightened, whispered voices. Tin whiskers certainly aren't a new problem. In fact, some of the first published reports of the occurrence date back to the 1940s and 1950s. But ...
 
 
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