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Tuesday, November 21, 2017
VOLUME -25 NUMBER 7
Publication Date: 07/1/2010
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Assembly and Packaging
Product Preview: Semicon West
July 2010 Issue
Front Page News
Quantum Computing Gets Closer
By Abby Vogel, Georgia Institute of Technology, Atlanta, GA
Despite a steady improvement in the speed of conventional computers during the last few decades, certain types of problems remain computationally difficult to solve. Quantum computers hold the promise of offering a new route to solving some of these problems, such as breaking encryptions ...
IPC Updates Power Conversion Standard
Bannockburn, IL — IPC - Association Connecting Electronics Industries
has released the "A" revision of IPC-9592, Requirements for Power Conversion Devices for the Computer and Telecommunications Industries. First released in 2008, IPC-9592 sets the requirements for power conversion devices (PCDs) in the ...
Enough Lithium for Everybody
By Walter Salm
The astonishing news that Afghanistan appears to have enormous stores of valuable minerals — especially lithium — has taken the scientific community by surprise.
KYZEN Climbs to New Heights
On November 2, 2017, KYZEN Employee TC Loy finally began his long-awaited quest to climb Mount Everest. After two years of preparation and delays due to Mother Nature, TC and a group of friends set out for Lukla, located in Northeastern Nepal, where locals welcomed them to the Himalayas (near Mount Everest) to begin their journey.
Nano Global, Arm Collaborate on Artificial Intelligence Chip to Drive Health Revolution by Capturing and Analyzing Molecular Data in Real Time
AUSTIN, TX - Nano Global, an Austin-based molecular data company, today announced that it is developing a chip using intellectual property (IP) from Arm, the world’s leading semiconductor IP company. The technology will help redefine how global health challenges - from superbugs to infectious diseases, and cancer are conquered.
ClassOne Slashes Via Liner Plating Costs for Compound Semi
KALISPELL, MT - ClassOne Technology (
), manufacturer of Solstice® plating systems for ≤200mm wafers, announced a new plating technique that provides significant cost reductions for compound semiconductor manufacturers who use gold plated vias.
"We have compound semiconductor customers that use gold for via liners who are switching to copper to save money," said Kevin Witt, President of ClassOne Technology.
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