Save. Share. Connect.
Sunday, December 4, 2016
VOLUME -25 NUMBER 7
Publication Date: 07/1/2010
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Assembly and Packaging
Product Preview: Semicon West
July 2010 Issue
Front Page News
Quantum Computing Gets Closer
By Abby Vogel, Georgia Institute of Technology, Atlanta, GA
Despite a steady improvement in the speed of conventional computers during the last few decades, certain types of problems remain computationally difficult to solve. Quantum computers hold the promise of offering a new route to solving some of these problems, such as breaking encryptions ...
IPC Updates Power Conversion Standard
Bannockburn, IL — IPC - Association Connecting Electronics Industries
has released the "A" revision of IPC-9592, Requirements for Power Conversion Devices for the Computer and Telecommunications Industries. First released in 2008, IPC-9592 sets the requirements for power conversion devices (PCDs) in the ...
Enough Lithium for Everybody
By Walter Salm
The astonishing news that Afghanistan appears to have enormous stores of valuable minerals — especially lithium — has taken the scientific community by surprise.
Murphy, Choh and Pilla Join ClassOne Technology's Board of Advisors
KALISPELL, MT - ClassOne Technology (
), manufacturer of advanced wet processing equipment for ≤200mm substrates announced the formation of a Board of Advisors. This body will be made up of highly-regarded senior executives from the semiconductor industry who will provide their perspective and guidance to ClassOne as it navigates the expansion of its operations.
Indium Corporation’s Karch Recognized for Best Presentation at IMAPS Autumn Conference 2016
CLINTON, NY - Indium Corporation’s
, Regional Technical Manager for Germany, Austria and Switzerland, was recognized for his technical presentation at the IMAPS Autumn Conference in October in Munich, Germany.
Karch was awarded “Best Presentation” for the session New Solder Material Technology in the Manufacturing Process of IGBT Modules, which discussed a new method that produces strong, reliable solder joints that resist cracking and thermal fatigue.
Ventec International Group Focus On High Thermal Performance Materials for Automotive and LED Applications at HKPCA 2016, China
SUZHOU, CHINA - Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, will exhibit in
, scheduled to take place
December 7th-9th, 2016
Shenzhen Convention & Exhibition Center, China
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 |
powered by GIM