Tuesday, July 26, 2016
VOLUME -25 NUMBER 6
Publication Date: 06/1/2010
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ARCHIVE >  June 2010 Issue >  New Products > 

Honeywell Intros New Thermal Management Materials
Morris Township, NJ — Honeywell Electronic Materials has introduced a new printable thermal management material designed to help manage the tremendous heat produced by increasingly powerful semiconductors in portable computing devices such as laptops and netbooks.

The new material, Honeywell PCM45M-SP, builds on the company's existing line of thermal management materials. As semiconductors become more powerful and smaller, more heat is being generated in the confined spaces where semiconductors are packaged for end-use applications. This tremendous heat can damage the semiconductor or degrade its performance, and it can damage the device as well. In typical mobile computing applications, chip temperature rises steeply at start-up and remains high during operation. PCM45M-SP is designed to meet these specific thermal management requirements, delivering reliable power cycling performance where other thermal materials would typically fail.

The new material can withstand more than 1,000 hours at 150°C without degradation and more than 1,000 temperature cycles. The application is not limited to heat sink design, and the material may be applied to a component, heat sink or thermal spreader in any shape built into the printing screen. In addition, the enhanced stability of this new material minimizes or eliminates the need for pre-mixing, conserving time and resources.

The phase change thermal interface consists of a sophisticated thermally conductive material with optimum filler size distribution to achieve maximum packing density compared with conventional phase change materials. It changes phase at 45°C to ensure maximum surface conformance.

Contact: Honeywell Electronic Materials, 1349 Moffett Park Drive, Sunnyvale, CA 94089 408-962-2000 fax: 408-980-1430 E-mail: lance.chapman@honeywell.com Web:
http://www.honeywell.com/em

 
 
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