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Tuesday, July 26, 2016
VOLUME -25 NUMBER 6
Publication Date: 06/1/2010
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People in the News
Electronic Mfg. Services
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Special Features: Test and Measurement
Product Preview: Atlantic Design/MDM
June 2010 Issue
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IMAPS: Advanced Tech. Workshop
Minneapolis, MN — IMAPS and IMAPS Viking Chapter will host an a new Advanced Technology Workshop on Microelectronic Packaging and Materials for Medical Devices. The workshop will be held in Minneapolis, Minnesota, June 10, 2010, at the Crowne Plaza Minneapolis Northstar Downtown. Registration will be on Wednesday, June 9, between 12:00 pm and 5:00 pm.
The combination of advancing demographics (an aging world population) and an explosion of new micro-electronics technology set the stage for significant improvement and miniaturization in the area of medical electronics.
A professional development course (PDC) is being offered: 1:00 pm - 5:00 pm: "Hermetic and `Near Hermetic' Testing of Class III Medical Implants". The course instructor is Thomas Green, TJ Green Associates. The PDC is co-located with the Workshop and available for a separate registration fee. The course is intended as an intermediate level course for process engineers, designers, quality engineers, and managers responsible for hermetic sealing, leak testing and RGA results and for those responsible for evaluating new polymeric cavity style packages.
Historically, hermeticity requirements for Class III Medical Implants have mirrored that for military and telecom applications. This course will briefly review the traditional hermeticity test methods (helium leak test and bubble method) and some of the pitfalls and lessons learned over the years. Recent changes to the hermeticity spec will be discussed along with the difficulties in testing to leak rates that are two orders of magnitude tighter than what exists today.
Packages made from polymeric materials (LCP and others) as opposed to traditional hermetic seals (metals, glasses, ceramics) require a different approach from a hermeticity design and testing standpoint. The problem is now one of moisture diffusion through the bulk and package interfaces, which is different than water vapor permeating a crack in a glass-to-metal seal.
A brief review of the techniques and methods to evaluate a "near-hermetic" approach is presented along with a discussion of the pitfalls and issues with TM 1014 (Seal) and TM 1018 (Internal Water Vapor) as applied to a "near hermetic package". Fick's law of moisture diffusion is the dominant theory guiding "near hermetic" package styles and testing such as WVTR, TGA and moisture diffusion coefficients are used in lieu of traditional helium based hermeticity techniques to evaluate and understand the integrity of the seal. Applications of moisture sensing inside a package and a discussion on how to qualify a "near hermetic" package will also be presented. Tabletop exhibits will be presented concurrently with the training and professional sessions.
Contact: IMAPS, 611 2nd St. N.E., Washington, DC 20002
202-548-4001 fax: 202-548-6115 Web:
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