Save. Share. Connect.
Sunday, May 27, 2018
VOLUME -25 NUMBER 6
Publication Date: 06/1/2010
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Test and Measurement
Product Preview: Atlantic Design/MDM
June 2010 Issue
Add Message Board
Cookson ALPHA Solder Paste Wins Awards
South Plainfield, NJ — Cookson Electronics has received SMT China's Vision award and EM Asia's Innovation award for ALPHA
CVP-360 Pb-free solder paste. This halogen-free product is available in ALPHA's SACX
alloys that offer reflow process yields comparable to higher silver SAC 305 and SAC 405 alloys. CVP-360 offers extremely high in-circuit pin test yields which can reduce circuit board assembly process cycle time. With its excellent print volume repeatability, ALPHA CVP-360 also provides value by reducing the defects associated with print process variability.
ALPHA CVP-360 is halogen-free per IEC 61249-2-21 and offers very high reflow process yields on Entek Plus HT OSP even after one prior Pb-free reflow and provides excellent pin-test yield for single and double reflow assemblies.
Contact: Assembly Materials, 109 Corporate Blvd., South Plainfield, NJ 07080
908-791-3045 fax: 908-791-3090 Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | firstname.lastname@example.org
powered by GIM