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Tuesday, February 21, 2017
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Nordson YESTech Debuts Upgraded Software
X3 automated 3D inspection system.
Carlsbad, CA — Nordson YESTech has upgraded YESPC software and has unveiled its FX Series AOI and advanced technology 3D X-Ray inspection solutions for populated printed circuit boards. The YESPC software is a web-based SPC (Statistical Process Control) tool that can be utilized for both real-time and historical charts and inspection reports.
When utilized in real-time mode, YESPC enables engineers to focus on defect prevention by monitoring for unwanted trends in the manufacturing process. User-selectable "chart windows" can be configured to show defect paretos, yield trends, machine utilization, as well as X-Y positional and Cp/Cpk data.
The latest version of YESPC now includes enhanced functionality in pareto charts that allows the user to drill down to defect and false call images. The latest upgrade of the software maximizes the capabilities of the company's line of inspection solutions. According to the company, the new FX series delivers the most complete inspection solution to date from the company, providing advanced automated inspection of solder and lead defects, component presence and position, correct part, polarity and through-hole parts. The FX Series AOI is equally well suited for high-volume or high mix manufacturing environments, providing fast throughput and high resolution for inspection of 010005 components. Programming is fast and easy; operators typically take less than 30 minutes to create a complete inspection program, including solder inspection. The system utilizes a standard package library to simplify training and insure program portability across manufacturing lines. The company's Advanced Fusion Lighting
and 5 megapixel image processing technology integrates several techniques, including color inspection, normalized correlation and rule-based algorithms, to provide complete inspection coverage with an extremely low false failure rate. And because the FX Series is configurable for all line positions, it is equally effective for paste, pre- and post-reflow and final assembly inspection. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.
The advanced technology X3 Automated X-Ray Inspection System (AXI) provides 3D inspection capability for fast and complete inspection of double-sided PCBs with BGAs and other critical solder joints. The X3's proprietary tomographic imaging technology rapidly gathers multiple oblique images to digitally construct 3D renderings that are used for unobstructed inspection of solder- and component-related defects on double sided boards. Multiple slices, or inspection planes, can be generated from the same set of oblique images at any time. The X3 offers the advanced image resolution available today, which is critical for maximum defect detection.
Contact: Nordson YESTECH, 2762 Loker Avenue West, Carlsbad, CA 92010
760-918-8471 fax: 760-918-8472 www.nordsonyestechinc.com
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