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Sunday, May 27, 2018
VOLUME -25 NUMBER 5
Publication Date: 05/1/2010
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Components and Distribution
Product Preview: EDS
May 2010 Issue
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ECTC Moves to Paris Hotel in Las Vegas
Piscataway, NJ — Changing its venue, the annual premier international packaging, components, and microelectronic systems technology conference, ECTC, or Electronic Components Technology Conference, will be held at the Paris Las Vegas in Las Vegas, Nevada, from June 1st through June 4th. While still being held in its rotational city, the conference this year will be held at the Paris rather than Caesar's, where it has been held for many years in the past.
There will be 36 oral sessions and five poster sessions. Broad categories include: advanced packaging; electronic components & RF; emerging technologies; interconnections; assembly & manufacturing technology; materials & processing; modeling & simulation; optoelectronics; applied reliability.
Highlights include special focus on 3D silicon packaging technologies with over six sessions dedicated to: through silicon via (TSV), via fill, silicon bonding, and applications.
There will be four special (invited) sessions: "RFID and RFID-enabled Sensors: Packaging, Reliability, and Integration" (Tuesday, June 1, 9 am) will address the technology challenges in materials, reliability, assembly, interconnects, passives, and integration with sensors and power sources.
"The Emergence of the Medical Devices Industry through the View-glass of Microelectronic Packaging Innovation" (Tuesday, June 1, 7:30 pm) will explain how new product functions are being enabled by medical device packaging innovations.
"The Evolution of Mobile Processing Architectures" (Wednesday, June 2, 7 pm) will discuss the evolution of mobile processing architectures as well as drivers for new silicon and packaging technologies.
"Advanced Bump and Bump-less Interconnection Technologies" (Thursday, June 3, 8 pm) will focus on several advanced interconnection technologies in Japan designed to meet increasing high pin count and fine pitch requirements.
Sixteen professional development courses (PDCs) are being prepared - eight in the morning and eight in the afternoon of June 1. These courses are targeted for in-depth half day learning or re-visiting of key technologies in our industry.
The Technology Corner. Leading companies primarily in the electronics components, materials, and packaging fields exhibit their latest technologies and products on June 2 and 3.
Contact: IEEE Meeting & Conference Management,
732-562-3878 fax: 732-981-1203 Web:
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