Thursday, May 26, 2016
VOLUME -25 NUMBER 5
Publication Date: 05/1/2010
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ARCHIVE >  May 2010 Issue >  Electronic Mfg. Products > 

DuPont Intros Flex Circuit Materials
Bonded flex circuit material.
Research Triangle Park, NC — DuPont Circuit & Packaging Materials (CPM) has introduced its newest high-performance laminate for printed circuit boards. Called DuPont Pyralux® TK flexible circuit material is a copper-clad laminate and bonding film system specifically formulated with DuPont Teflon® fluoropolymer film and Kapton® polyimide film for high speed digital and high frequency flexible circuit applications.

According to the company, the new material delivers the lowest dielectric constant (DK) of any thin laminate and bondply material on the market today.

With a dielectric constant of 2.3 to 2.7, and low loss dissipation factor (DF) of 0.002 or 0.003 depending on the film construction, Pyralux TK is designed for high-speed flex applications, including microstrip and stripline-controlled impedance construction. The clad dielectric is a proprietary layered composite of Teflon and Kapton films.

A variety of copper foil weights are available; the standard foils are 18 and 35µ rolled annealed (RA) copper. Pyralux TK bonding film is also a layered dielectric, made with Teflon and Kapton films. The bonding film contains a Teflon film with a lower lamination temperature than the clad. The Teflon in the bonding film is also available separately as a sheet adhesive.

The thin (2 to 4 mil) material is available in laminate thicknesses of 50, 75 and 100µ. Bondply thicknesses are available in 75 or 100µ. The company also plans to offer a Pyralux TK sheet adhesive in 12, 25, and 50µ.

Contact: DuPont Circuit & Packaging Materials, 14TW Alexander Drive, Research Triangle Park, NC 27709 800-243-2143 fax: 570-268-3699 Web:
http://www.pyralux.dupont.com

 
 
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