Monday, October 23, 2017
VOLUME -25 NUMBER 5
Publication Date: 05/1/2010
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Archive >  May 2010 Issue >  Front Page News > 
Fuel Cell-Powered Mobile Lighting for Academy Awards

Livermore, CA — A team led by Sandia National Laboratories made a cameo appearance at the 82nd Annual Academy Awards® ceremony in Los Angeles. They didn't win any Oscars, but instead provided some fuel-cell powered outdoor lighting.
 
Sandia, The Boeing Company, the California Department of Transportation (Caltrans), Altergy Systems, Multiquip Inc., and others developed a novel mobile lighting system...
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Storing Hydrogen in Layered Graphene

Gaithersburg, MD — Graphene — carbon formed into sheets a single atom thick — now appears to be a promising base material for capturing hydrogen, according to recent research at the National Institute of Standards and Technology (NIST) and the University of Pennsylvania. The findings suggest stacks of ...Read More
IPC Updates Lead-Free Labeling

Bannockburn, IL — IPC — Association Connecting Electronics Industries — has released the "A" revision of IPC J-STD-609, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes. This standard presents a marking and labeling system that aids in ...Read More


 
 
European Space Agency approval for Ventec material in Amphenol Invotec rigid & flex-rigid production

Amphenol Invotec, one of Europe’s leading manufacturers of complex printed circuit boards (PCBs), and Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, are delighted to announce that Ventec's VT-901 polyimide material is now fully qualified by ESA in Amphenol Invotec’s manufacturing process for rigid and Flex-rigid PCBs.


New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

DELAWARE, OH Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.


 
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