Saturday, April 21, 2018
VOLUME -25 NUMBER 5
Publication Date: 05/1/2010
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Archive >  May 2010 Issue >  Front Page News > 
Fuel Cell-Powered Mobile Lighting for Academy Awards

Livermore, CA — A team led by Sandia National Laboratories made a cameo appearance at the 82nd Annual Academy Awards® ceremony in Los Angeles. They didn't win any Oscars, but instead provided some fuel-cell powered outdoor lighting.
 
Sandia, The Boeing Company, the California Department of Transportation (Caltrans), Altergy Systems, Multiquip Inc., and others developed a novel mobile lighting system...
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Storing Hydrogen in Layered Graphene

Gaithersburg, MD — Graphene — carbon formed into sheets a single atom thick — now appears to be a promising base material for capturing hydrogen, according to recent research at the National Institute of Standards and Technology (NIST) and the University of Pennsylvania. The findings suggest stacks of ...Read More
IPC Updates Lead-Free Labeling

Bannockburn, IL — IPC — Association Connecting Electronics Industries — has released the "A" revision of IPC J-STD-609, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes. This standard presents a marking and labeling system that aids in ...Read More


 
 
SMTA Europe's Harsh Environments Conference Session 7 to Focus on Hi-Temp Mats/Fab
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.      
EOS WLC550 series offers maximum Cooling Flexibility on Standard Footprint
Last week at the MT-CONNECT in Nuremberg more than 150 companies from the European MedTec Business met for discussing the latest trends and guidelines in MedTec industry. When EOS power presented its medical up to class-2 powersupplies at MT-CONNECT, the EOS team made an exciting observation: While everyone is still talking about the size of the powersupplies, which is still very true for home devices, the real crucial factor for sales support for larger devices at the MT connect was the cooling.   
SEMI and TechSearch International Report Global Semiconductor Packaging Materials Market Reaches $16.7 Billion

MILPITAS, CA SEMI, the industry association representing the global electronics manufacturing supply chain, and TechSearch International today reported that the global semiconductor packaging materials market reached $16.7 billion in 2017. While slower growth of smartphones and personal computers – the industry’s traditional drivers – is reducing material consumption, the slowdown was offset by strong unit growth in the cryptocurrency market in 2017 and early 2018. Flip chip package shipments into the cryptocurrency market, while providing a windfall to many suppliers, are not expected to remain at high levels.  


C&K ANNOUNCES THAT IT HAS ACQUIRED VUILLERMOZ
Newton, MA – C&K, one of the world’s most trusted brands of high-quality electromechanical switches, today announces that it has acquired the company Vuillermoz, a micro-mechanical components and tooling company located in St. Claude, France.



 
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