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Thursday, March 23, 2017
VOLUME -25 NUMBER 5
Publication Date: 05/1/2010
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Components and Distribution
Product Preview: EDS
May 2010 Issue
Front Page News
Fuel Cell-Powered Mobile Lighting for Academy Awards
Livermore, CA — A team led by Sandia National Laboratories made a cameo appearance at the 82nd Annual Academy Awards
ceremony in Los Angeles. They didn't win any Oscars, but instead provided some fuel-cell powered outdoor lighting.
Sandia, The Boeing Company, the California Department of Transportation (Caltrans), Altergy Systems, Multiquip Inc., and others developed a novel mobile lighting system...
Storing Hydrogen in Layered Graphene
Gaithersburg, MD — Graphene — carbon formed into sheets a single atom thick — now appears to be a promising base material for capturing hydrogen, according to recent research at the National Institute of Standards and Technology (NIST) and the University of Pennsylvania. The findings suggest stacks of ...
IPC Updates Lead-Free Labeling
Bannockburn, IL — IPC — Association Connecting Electronics Industries — has released the "A" revision of IPC J-STD-609, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes. This standard presents a marking and labeling system that aids in ...
European SEMI Award Honors Advanced Packaging Technologists
MUNICH, GERMANY - At the SEMI Industry Strategy Symposium in Munich, SEMI announced recipients of the European SEMI Award for 2016:
, deputy director of the Fraunhofer IZM;
, fellow and program director of 3D System Integration at imec; and
SHENMAO America, Inc. Introduces Omega Aleaciones S.A. de C.V. the Exclusive Mexico Distributor of SHENMAO Solder Paste & Flux
JALISCO, MEXICO - Omega Aleaciones S.V. Sales and Application Engineering Team reinforces SHENMAO’s commitment to providing our worldwide EMS and OEM customers with the highest quality and technical solutions Solder Paste to meet the challenges of today’s SMT Assembly and Product Reliability throughout Mexico.
MEMS & Sensors Industry Group Tackles Technical Challenges at Annual Technical Congress: May 10-11 at Stanford University (Stanford, CA)
PITTSBURGH, PA - Microelectromechanical systems (MEMS) and sensors suppliers are targeting a rapidly growing global market for their devices, key components that increase the intelligence and interactivity of billions of electronic products.
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