Tuesday, May 23, 2017
VOLUME -25 NUMBER 5
Publication Date: 05/1/2010
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Archive >  May 2010 Issue >  Front Page News > 
Fuel Cell-Powered Mobile Lighting for Academy Awards

Livermore, CA — A team led by Sandia National Laboratories made a cameo appearance at the 82nd Annual Academy Awards® ceremony in Los Angeles. They didn't win any Oscars, but instead provided some fuel-cell powered outdoor lighting.
 
Sandia, The Boeing Company, the California Department of Transportation (Caltrans), Altergy Systems, Multiquip Inc., and others developed a novel mobile lighting system...
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Storing Hydrogen in Layered Graphene

Gaithersburg, MD — Graphene — carbon formed into sheets a single atom thick — now appears to be a promising base material for capturing hydrogen, according to recent research at the National Institute of Standards and Technology (NIST) and the University of Pennsylvania. The findings suggest stacks of ...Read More
IPC Updates Lead-Free Labeling

Bannockburn, IL — IPC — Association Connecting Electronics Industries — has released the "A" revision of IPC J-STD-609, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes. This standard presents a marking and labeling system that aids in ...Read More


 
 
Ventec: Thomas Michels to Speak at the EIPC Summer Conference
SUZHOU, CHINA - Ventec's European Managing Director Thomas Michels will speak at EIPC Summer Conference on June 1st & 2nd, 2017 to be held at the Best Western Plus Manor Hotel, Solihull, UK.

Indium Corporation’s Mackie to Present at IMAPS ATW on Advances in Semiconductor Packaging
CLINTON, NY - Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will present at the IMAPS Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging on June 15 at Binghamton University in Vestal, N.Y.

Dr. Mike Bixenman Discusses Non-Standard Test Methods at ICSR
NASHVILLE, TN - KYZEN is pleased to announce that Mike Bixenman, DBA will present at the International Conference on Soldering & Reliability (ICSR) held in conjunction with the Toronto SMTA Expo & Tech Forum.
 

 
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