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Tuesday, September 27, 2016
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RBP Intros Hot-Air Leveling Flux
Milwaukee, WI — RBP Chemical Technology has introduced Flo Rite 60, a new water-rinseable hot-air leveling flux. The unusual formulation effectively removes light copper oxides and lays down a uniform layer of flux to promote good solderability on the copper without bridging. The new flux is a solvent-free, non-foaming flux that rinses easily leaving the solder mask free of residues.
According to the company, with the introduction of the new flux, the company now has a flux that is compatible with standard and higher density printed circuit board applications for both eutectic solder and lead-free SAC alloys.
Contact: RBP Chemical Technology, Inc., 150 S. 118th Street, Milwaukee, WI 53214-0069
414-258-0911 fax: 414-258-7908 Web:
http://www.rbpchemical.com
See at APEX Booth #1040.
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