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Manncorp: Budget-Priced SMT Equipment
Publication Date: 3/26/2010

Willow Grove, PA — Manncorp is showcasing its best sellers from each of three major equipment categories: the dual-head MC-385 pick-and-place, the T200A budget-priced lead-free batch reflow oven, and the RW-400 split-vision rework station.
Mirtec Adds 15MP Vision to AOI
Publication Date: 3/26/2010

Oxford, CT — Mirtec Corp. is showing its complete line of AOI and SPI systems, including the latest advances to its inspection systems. Front-runner is the company's new 15 Megapixel ISIS Vision System. According to the company, this is still in prototype development, but it is believed that this ...
Mydata: Jet Printer Offers Versatility
Publication Date: 3/26/2010

Bromma, Sweden — Mydata's Jet Printer MY500 uses what the company calls a revolutionary new technology for solder paste application, shooting solder paste on the fly without actually touching the PCB.
Nordson EFD: New Solder Paste Glows Under UV
Publication Date: 3/26/2010

Providence, RI — Nordson EFD's new Solder Plus® UV is a UV-fluorescent solder paste that enables pre- and post-reflow detection of solder deposits on automated production lines with cost-effective standard vision systems. Typical uses include consumer electronics, automotive and medical device applications.
It is very difficult to detect solder paste deposits and verify proper reflow with conventional vision systems and inspection software. By exciting Solder Plus UV paste with a UV light source causes it to emit a fluorescence that is easily detected with
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Nitrogen Generating System from Pillarhouse
Publication Date: 3/26/2010

Widford, UK — The PillarGen Nitrogen Generation System from Pillarhouse has been specifically designed to meet the nitrogen supply requirements of the GEM, Jade, Orissa, Orissa MPR and latest Jade Handex and Orissa Synchrodex Systems.
PVA Unveils Non-Atomized Film Coating Valve
Publication Date: 3/26/2010

Halfmoon, NY — PVA (Precision Valve & Automation, Inc.) is introducing the FC100-CF non-atomized film coating valve for solvent-based chemistries requiring superior edge definition and control. The new valve is suitable for building wet film thicknesses of 0.008-in. (0.2mm) and above while promoting robotic ...
Qualitek Intros Peelable Solder Mask
Publication Date: 3/26/2010

Addison, IL — Ceasolder-PAL is a temporary, peelable solder mask comprised of a thixotropic, synthetic acrylic latex designed to withstand fluxing, wave soldering and cleaning operations.
According to the company, it is intended for use in applications such as robotic, pneumatic, hand applied or template screening. The film is easy to peel, non-flammable and ammonia-free. It is available...
RBP Intros Hot-Air Leveling Flux
Publication Date: 3/26/2010

Milwaukee, WI — RBP Chemical Technology has introduced Flo Rite 60, a new water-rinseable hot-air leveling flux. The unusual formulation effectively removes light copper oxides and lays down a uniform layer of flux to promote good solderability on the copper without bridging. The new flux is a solvent-free ...
Seica: Auto Test Program Generation
Publication Date: 3/26/2010

Strambino, Italy — Seica Inc., in partnership with Temento Systems, has developed the FlyScan module as a new approach to the integration of boundary scan and flying probe test systems. The true innovation of FlyScan is available on the complete line of Pilot/Aerial flying probe testers. It represents ...
Closed-Loop Stencil Cleaners from Smart Sonic
Publication Date: 3/26/2010

Canoga Park, CA — Smart Sonic is introducing the EnviroGuard 100 percent Closed-loop Stencil Cleaner — described as the first and only aqueous stencil cleaner that can clean all types of solder paste with a 100 percent closed-loop process — wash and rinse.
Sonoscan Expands Fake Part ID Menu
Publication Date: 3/26/2010

Elk Grove Village IL — SonoLab®, the applications laboratory division of Sonoscan, has recently developed analytical techniques that raised to 25 the total number of acoustically detectable features and characteristics used to separate counterfeit plastic IC packages from genuine packages.\par ...
Universal Adds New PTH Assembly Machine
Publication Date: 3/26/2010

Conklin, NY — Universal Instruments has expanded the lead span capability of its Radial 8XT insertion machine by introducing what it calls the industry's first 5.0/7.5/10.0mm triple-span radial machine. This large span capacity virtually eliminates tedious manual assembly requirements, thereby improving product quality and providing greater accuracy for through-hole applications. The latest advancement in the Generation 8 equipment lineup ...
Viscom Intros New Wire Bond Inspection Tools
Publication Date: 3/26/2010

Atlanta, GA — Viscom is introducing new software tools for its VHR (very high resolution) camera module which has the ability to provide exact measurements of balls and wedges in wire-bonding applications. With this technology, 25µm gold thin-wire wedge sizes can be measured with a standard deviation ...
Vi Technology Intros New Inspection Programming
Publication Date: 3/26/2010

Saint-Egreve, France — Vi Technology® has launched Vision2009, the new integrated software suite, which goes a step further in simplifying programming for PC board layout.
Nordson YESTECH: Hi-Yield AOI/X-Ray Inspection
Publication Date: 3/26/2010

Carlsbad, CA — Nordson YESTECH's high-speed FX Series and BX Benchtop AOI systems are configurable with 5 megapixel color camera imaging technology. With one top-down and 4 side-viewing cameras, the FX Series inspects solder joints and verifies correct part assembly enabling users to improve quality ...
Zestron: Greener Cleaning Chemistries
Publication Date: 3/26/2010

Manassas, VA — Environmentally responsible cleaning is Zestron's goal with such products as VIGON® N 501, released in 2009. Now the company is expanding its focus to encompass even greener cleaning chemistries and technologies in 2010.
Zestron moved to the forefront by developing pH-neutral aqueous cleaning agents such as VIGON N 501. This product is fully biodegradable and free of any halogenated compounds and therefore...
FocalSpot Upgrades Inspection Systems, Intros In-Line AOI
Publication Date: 3/26/2010

San Diego, CA — FocalSpot, Inc. is introducing two new products and two improved products. The new and improved products continue the company's expansion of affordable yet high quality professional and easy-to-use x-ray and optical inspection platforms.
FocalSpot Upgrades & Intros New Inspection Systems
Publication Date: 3/26/2010

San Diego, CA — FocalSpot, Inc. is introducing two new products and two improved products. The new and improved products continue the company's expansion of affordable yet high quality professional and easy-to-use x-ray and optical inspection platforms.
APS Intros Entry Level Selective Soldering
Publication Date: 3/26/2010

Huntingdon Valley, PA — APS Novastar, LLC is unveiling a new cost-effective and reproducible solution for automated selective soldering with the introduction of its ESS Selective Soldering Machines. Specifically designed for assemblers making the transition from manual or semi-automatic to automated ...
Ascentech, GEN3 Intro New Cleanliness Test Systems
Publication Date: 3/26/2010

Chester, CT — GEN3 Systems and Ascentech are introducing an entirely new line-up of Ionic Cleanliness Test systems. Cleanliness test processes and equipment have been evolving for more than 40 years, but now GEN3 Systems has created a new and unusual line of test equipment. Ascentech is the North American distributor for GEN3 Systems Ltd products.
The new lineup consists of systems with larger test capacity, innovative measurement software and hardware, and a new budget-sensitive cost structure. According to the company, all of the new
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