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Tuesday, May 31, 2016
VOLUME -25 NUMBER 3
Publication Date: 03/1/2010
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Special Features: SMT and Production
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March 2010 Issue
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Nextreme Hi-Temp TE Module Cools Laser Diodes
Optocooler and laser diode.
Durham, NC — Nextreme Thermal Solutions is now offering an updated version of the OptoCooler HV14 that will withstand assembly temperatures as high as 320°C. This high assembly temperature tolerance makes the device compatible with eutectic gold-tin (AuSn) solder — the industry standard process for packaging
optoelectronic devices that require tight tolerances. Specific applications include laser diodes, semiconductor optical amplifiers and sensors.
The module is a high heat-pumping thermoelectric device that is designed for standard electrical power requirements. At 85°C, the HV14 operates at a maximum of 2.7V and can pump 1.7 watts of heat in a footprint of only 3mm
. The module can create a temperature differential (ΔT) of up to 50°C between its hot and cold sides, making it suitable for cooling and temperature control of optoelectronic devices such as laser diodes.
AuSn solder provides excellent joint strength, strain resistance and thermal conductivity. After the initial reflow during device assembly, the melting point of this particular AuSn solder is 320°C, enabling subsequent attachment of laser diodes and other devices to the TE modules at lower temperatures, typically at 283°C, which is the industry standard. The use of this strain-resistant material is particularly important for the laser diodes where movement of solder as little as 10µ can cause significant alignment issues.
Contact: Nextreme, 3908 Patriot Dr., Suite 140, Durham, NC 27703-8031
919-597-7300 E-mail email@example.com Web:
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