Saturday, July 30, 2016
VOLUME -25 NUMBER 3
Publication Date: 03/1/2010
Advertisements
ARCHIVE >  March 2010 Issue >  Product Preview: APEX > 

Mirtec Adds 15MP Vision to AOI
MV-7X in-line AOI system.
Oxford, CT — Mirtec Corp. is showing its complete line of AOI and SPI systems, including the latest advances to its inspection systems. Front-runner is the company's new 15 Megapixel ISIS Vision System. According to the company, this is still in prototype development, but it is believed that this new technology will bring unprecedented speed and performance to the inspection industry.

The new ISIS Vision System is being shown as part of the MV-7xi in-line AOI system. Fully configured, this system uses one top-down-view 5 Megapixel camera, with a precision 9.8µ telecentric compound lens plus four 5 Megapixel side-view cameras. The patented "Quad Angle Lighting System" provides four independently programmable zones for optimal illumination of inspection areas. The system as configured also includes a 2D camera bar code reader, a high-throughput, three-stage PCB conveyor and a PCB under-board support system. The system also includes the company's exclusive Intelli-Scan Laser System, which provides the 3rd dimension in inspection capability — the ability to precisely measure the Z-height of a given region of interest. This advanced technology offers: superior lifted-lead detection for gull wing devices, four-point height measurement capability for co-planarity testing of BGA and CSP devices, and enhanced solder paste measurement capability. The system is powerful yet simple to use. A comprehensive package type library provides simple drag-and-drop component programming. The Automatic Teaching Tool (ATT) software provides automatic teaching of component locations using CAD centroid data.

The Mirtec MV-3L Desktop AOI System is the industry?s most widely accepted Five Camera Desktop AOI system.

New this year is an MV-3L Desktop AOI System configured with a Top-Down View 5 megapixel camera, with a precision 9.8µ telecentric compound lens and four 5 megapixel side-view cameras. It also incorporates the Intelli-Beam Laser System. This advanced technology provides four-point height measurement capability for co-planarity testing of BGA and CSP devices, as well as enhanced solder paste measurement capability.

Also being shown is the Mirtec MS-11 In-Line SPI System, which uses shadow-free moire phase shift imaging technology to inspect solder paste deposition on PCB's post-screen print. This technology is reportedly far superior to laser SPI technology. The MS-11 will inspect for insufficient solder, excessive solder, shape deformity, shift of deposition, and bridging. The system is configured with an ultra-high resolution 4 megapixel telecentric camera system for enhanced image quality and superior accuracy. It uses the same robust platform as the company's MV-7 Series. Inspection heads are interchangeable between the two systems, adding ultimate flexibility to the inspection process.

Contact: Mirtec Corp., 3 Morse Rd. #2A, Oxford, CT 06478 203-881-5559 fax: 203-881-3322 Web:
http://www.mirtecusa.com

See at APEX Booth #2219.

 
 
search login