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VOLUME -25 NUMBER 3
Publication Date: 03/1/2010
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Special Features: SMT and Production
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March 2010 Issue
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IPC Int'l Conference Spotlights Lead-Free
Bannockburn, IL — IPC Europe's IPC International Conference on Reliability and Quality of Lead-Free Electronics is scheduled to be held in Frankfurt am Main, Germany, May 20-21, 2010. The event will feature renowned international industry experts and will focus on the most recent facts, trends and challenges in lead-free manufacturing influencing the quality and reliability of an assembled PCB.
The conference and workshop sessions will offer information relevant to all facets of the electronics supply chain, from electronic design and CAD to via bare board to assembling and soldering. On Thursday, May 20, the one-day conference seminars will cover the parameters that affect quality and reliability, how to reduce costs while increasing quality, design for reliability for lead-free electronic products, process qualification of lead-free process versus tin-lead and more. Conference speakers Bo Andersson, technical manager, NCAB Group; Jean-Paul Clech, founder of EPSI USA; Werner Engelmaier, president of Engelmaier Associates, L.C.; Lorenza Lombardi, materials laboratory manager, B.A.M.E.S. Italy; and Lars Wallin, IPC European representative, will share their expertise and extensive industry experience.
Three concurrent, half-day workshops on Friday, May 21, will offer attendees in-depth instruction on lead-free solder joint reliability, material properties and acceleration factors; increasing reliability and quality with the help of IPC standards; and reliability issues and solutions for lead-free soldered electronic products.
Attendees can register for the one-day conference, one of the three concurrent workshops or both. Applications for a limited number of tabletop displays are also available.
Contact: IPC European Representative Lars Wallin
+46 08-26 10 07 E-mail: LarsWallin@ipc.org Web:
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