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Wednesday, January 18, 2017
VOLUME -25 NUMBER 3
Publication Date: 03/1/2010
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: SMT and Production
Product Preview: APEX
March 2010 Issue
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At APEX: Negotiating New Business Climate
Bannockburn, IL — A hot topic during APEX: How do PCB manufacturers and EMS providers successfully negotiate the new business climate? Senior executives of PCB and EMS companies will convene on Wednesday, April 7, 2010 at the IPC Management Meetings to get answers to this question and more. The PCB Executive Management Meeting and the EMS Management Council Meeting are focused on the specific business issues industry executives face. These two exclusive full-day summits will be held in conjunction with IPC APEX EXPO at the Mandalay Bay Resort and Convention Center in Las Vegas.
At the EMS Management Council Meeting, executives from companies in the U.S. and China will share their strategies for success and open a dialogue for an insightful Q&A session. The PCB and EMS management meetings are exclusively for senior executives from PCB and EMS companies.
Wallace Leyshon, operating partner, Heartland Industries, will discuss the current market for micro EMS firms and reveal the factors that drive valuation and how they can be improved upon. On the accounting side, Brian Throneberry, vice president of sales, API Technologies Corp., will navigate putting theory into practice as he makes sense of various cost accounting methods and explains how each impacts profitability specific to an EMS company. Attendees will also get expert advice on how to break into the new opportunities that solar/photovoltaics and LED technologies present as well as what it will take in terms of equipment, people, processes and capital. Finally, in "The Lean Surface Mount Line," Kenneth Heifner, vice president of quality & operations, SMS Technologies, will report on the industry's best practices to develop a world-class manufacturing environment.
Attendees of the PCB Executive Management Meeting will get an inside look at what consolidation truly means for the industry and PCB manufacturers from Jack Calderon, managing director, Lincoln International. Executives will also learn about new technological opportunities that are ripe for PCB manufacturers from John Dement, technology engagement office/ORTA, NSWC Crane, and Pam Simonds, general manager, Amphenol Printed Circuits. Sharing how to effectively protect a company's most valuable asset — intellectual property — Raj Kumar, vice president and chief technology officer with DDi, will discuss all you need to know, from what is patentable to how to begin the process. Understanding where a company stands in comparison to its competitors is invaluable information that helps direct a company's priorities and strategies. In "Where Should You Be? Results of the IPC PCB Executive Benchmarking Survey," Sharon Starr, IPC director of market research, will disclose some preliminary findings such as the industry's average cash-to-cash cycle time, average cost of goods sold as a percentage of sales, and average capacity utilization.
Both meetings will have roundtable discussion sessions, where attendees can openly exchange thoughts on strategies and solutions to common issues. "It's an invaluable resource for firsthand information from those who face the same issues I do," says PCB executive Jim Fuller, vice president with Endicott Interconnect Technologies. Michael Goeringer, vice president with Arc-Tronics agrees, "I get to meet other EMS executives, hear how they are solving their problems and exchange thoughts on the future of the industry. I always leave with tangible ideas on how to improve and grow Arc-Tronics."
IPC Designers Day
Designers Day comes on Thursday, April 8, 2010 — Day 3 of the APEX Show. This full-day event focused on PCB design will offer practical information and real-world applications in design. Leading off Designers Day, keynote speaker Dieter Bergman, IPC director of technology transfer, will provide an overview of the roadmap of the future for electronic design. Industry experts such as Rick Hartley, senior principal engineer, L-3 Avionics; Dan Smith, CID+, designer for a defense and aerospace manufacturer; and Susy Webb, CID, senior designer, Fairfield Industries, will provide in-depth presentations on design issues and advancements. Topics include electromagnetic interference (EMI) control, high speed design, high density interconnect (HDI) and placement and routing decision making.
Along with the educational program, lunch and a networking reception, Designers Day registration includes free admission to the exhibit hall, standards development meetings, keynote sessions, free forums and poster sessions.
Mark Radley, CID+, design engineer, RPA Electronic Solutions, found value in his participation in the designer certification program, Designers Day and the exhibition when he attended in 2009, reporting, "I attended excellent presentations given by leaders in the industry." In addition to meeting with some of his current suppliers, Mark made many new contacts through fellow designers. "I have a renewed enthusiasm for our profession and this industry," he added.
Other IPC APEX EXPO activities focused on design include half-day professional development courses on Friday, April 9, covering topics from the basics of PCB design, to high-speed design, to design for manufacturing (DFM) and more.
In addition, Designer Certification workshops and exams will be available April 9-11. The certified interconnect designer (CID) and advanced certified interconnect designer (CID+) designations are valuable credentials that demonstrate personal and organizational commitment to continuing education and the design profession.
Contact: IPC, Susan Filz, director of industry programs
847-597-2884 E-mail: SusanFilz@ipc.org Web:
Contact: IPC, Anne Marie Mulvihill, manager of professional development
847-597-2827 E-mail: AnneMarieMulvihill@ipc.org Web:
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