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Friday, May 25, 2018
VOLUME -25 NUMBER 3
Publication Date: 03/1/2010
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: SMT and Production
Product Preview: APEX
March 2010 Issue
Front Page News
Electric Cars: the Next 10 Years
By Dr. Peter Harrop, Chairman, IDTechEx, Cambridge, UK
A radical change in attitude to electric vehicles has occurred in 2009, resulting in huge new financing from governments and tough new laws that will boost sales. Now all car makers must offer electric versions in their lineups or face oblivion as governments finally get serious about ...
NIST Facility Tests Hydrogen Materials
Boulder, CO — If hydrogen is ever to play a significant role as a clean, everyday energy source, it will need a safe and reliable distribution system. To pave the way for a hydrogen fuel infrastructure, researchers at the National Institute of Standards and Technology (NIST) Boulder Labs recently launched the ...
Cheaper Solar Cells with HDD Drive Technology
By Tom Djokovich, CEO, XsunX, Inc.
Aliso Viejo, CA — Finding more efficient and cheaper production techniques for making solar cells is a number-one priority in our nation's "green" manufacturing sector. Now CIGS (copper indium gallium selenide) thin-film solar cell designer XsunX, Inc. is developing a novel manufacturing technique ...
Indium Corporation Expert to Present at PCIM Europe
CLINTON, NY -
expert, Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will present at
on Wednesday, June 6, in Nuremberg, Germany.
Vijay will present Improve Reliability and Bondline Control with InFORMS® and Indalloy®276.
SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.
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