Monday, October 23, 2017
VOLUME -25 NUMBER 3
Publication Date: 03/1/2010
Advertisements

Archive >  March 2010 Issue >  Front Page News > 
Electric Cars: the Next 10 Years


A radical change in attitude to electric vehicles has occurred in 2009, resulting in huge new financing from governments and tough new laws that will boost sales. Now all car makers must offer electric versions in their lineups or face oblivion as governments finally get serious about ...
Read More
NIST Facility Tests Hydrogen Materials

Boulder, CO — If hydrogen is ever to play a significant role as a clean, everyday energy source, it will need a safe and reliable distribution system. To pave the way for a hydrogen fuel infrastructure, researchers at the National Institute of Standards and Technology (NIST) Boulder Labs recently launched the ...Read More
Cheaper Solar Cells with HDD Drive Technology


Aliso Viejo, CA — Finding more efficient and cheaper production techniques for making solar cells is a number-one priority in our nation's "green" manufacturing sector. Now CIGS (copper indium gallium selenide) thin-film solar cell designer XsunX, Inc. is developing a novel manufacturing technique ...Read More


 
 
European Space Agency approval for Ventec material in Amphenol Invotec rigid & flex-rigid production

Amphenol Invotec, one of Europe’s leading manufacturers of complex printed circuit boards (PCBs), and Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, are delighted to announce that Ventec's VT-901 polyimide material is now fully qualified by ESA in Amphenol Invotec’s manufacturing process for rigid and Flex-rigid PCBs.


New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

DELAWARE, OH Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.


 
search login