Saturday, April 21, 2018
VOLUME -25 NUMBER 3
Publication Date: 03/1/2010
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Archive >  March 2010 Issue >  Front Page News > 
Electric Cars: the Next 10 Years


A radical change in attitude to electric vehicles has occurred in 2009, resulting in huge new financing from governments and tough new laws that will boost sales. Now all car makers must offer electric versions in their lineups or face oblivion as governments finally get serious about ...
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NIST Facility Tests Hydrogen Materials

Boulder, CO — If hydrogen is ever to play a significant role as a clean, everyday energy source, it will need a safe and reliable distribution system. To pave the way for a hydrogen fuel infrastructure, researchers at the National Institute of Standards and Technology (NIST) Boulder Labs recently launched the ...Read More
Cheaper Solar Cells with HDD Drive Technology


Aliso Viejo, CA — Finding more efficient and cheaper production techniques for making solar cells is a number-one priority in our nation's "green" manufacturing sector. Now CIGS (copper indium gallium selenide) thin-film solar cell designer XsunX, Inc. is developing a novel manufacturing technique ...Read More


 
 
SMTA Europe's Harsh Environments Conference Session 7 to Focus on Hi-Temp Mats/Fab
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.      
EOS WLC550 series offers maximum Cooling Flexibility on Standard Footprint
Last week at the MT-CONNECT in Nuremberg more than 150 companies from the European MedTec Business met for discussing the latest trends and guidelines in MedTec industry. When EOS power presented its medical up to class-2 powersupplies at MT-CONNECT, the EOS team made an exciting observation: While everyone is still talking about the size of the powersupplies, which is still very true for home devices, the real crucial factor for sales support for larger devices at the MT connect was the cooling.   
SEMI and TechSearch International Report Global Semiconductor Packaging Materials Market Reaches $16.7 Billion

MILPITAS, CA SEMI, the industry association representing the global electronics manufacturing supply chain, and TechSearch International today reported that the global semiconductor packaging materials market reached $16.7 billion in 2017. While slower growth of smartphones and personal computers – the industry’s traditional drivers – is reducing material consumption, the slowdown was offset by strong unit growth in the cryptocurrency market in 2017 and early 2018. Flip chip package shipments into the cryptocurrency market, while providing a windfall to many suppliers, are not expected to remain at high levels.  


C&K ANNOUNCES THAT IT HAS ACQUIRED VUILLERMOZ
Newton, MA – C&K, one of the world’s most trusted brands of high-quality electromechanical switches, today announces that it has acquired the company Vuillermoz, a micro-mechanical components and tooling company located in St. Claude, France.



 
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