Milwaukie, OR, –
ECD of Milwaukie, OR, USA, announced the addition of several new classes to its ECD-University Program. All ECD-U classes provide training at your desk via an instructor-led live webcast, with question and answer time available. A leading manufacturer of innovative thermal profiling equipment and software since 1964, ECD created ECD-U as a service to the industry, and has taught more than 2,000 students in the last several years. Classes are free, and require only an hour of your day.
Entitled “Profiling A-Z” the first new class covers how to determine what points to profile (trouble spots, at-risk/"sensitive” components), thermocouple attachment methods (strategies for success, what to use when), and Thermal Quality Management’s (ThQM™) core steps to profiling success (how to generate the oven recipe, how to document the results & build SPC data, and much more).
The second new class, “Verification 101” shows how reflow oven Verification is a key, yet often missing, stage in any true and complete thermal quality management program. When used in its totality, a good thermal quality management program such as ThQM™ can reduce scrap and increase yield in your reflow solder process. It provides a guide to elicit the often missing dialogue between OEM and EMS and, together with a good system of oven verification, increases throughput and reduces liability by documenting adherence to the profile.
Verification 101 will be presented on February 23 at 8:00 AM PST. Visit
www.ecd.com/ecdu to find complete February class schedules and online registration information.