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VOLUME -25 NUMBER 2
Publication Date: 02/1/2010
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Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Components and Distribution
Product Preview: Electronics West / MDM
February 2010 Issue
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MH&W: Ultra-Low Silicone Thermal Gap Filler
Low-silicone gap-filler pad.
Mahwah, NJ — MH&W International has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0W/mK of thermal conductivity between hot components and their heat sinks. The gap filler's minimal silicone content makes it suitable for use in silicone-sensitive applications including medical electronics, laser optics and telecommunications. These are applications where silicone-based outgassing can lead to contamination and condensation issues or leave oily residues that interfere with process applications. The TP-S3 family of materials was developed by Chang Sung Corp. and is manufactured by Dongyun Electronics in South Korea.
Pads of TP-S3LS material are soft and compliant for easy compression and filling of air gaps between irregular mating surfaces. The material's Shore 00 hardness is 55. The pads can be used in temperatures up to 200°C, which exceeds the use range of silicone-free gap fillers. The material has a UL 94 flame class rating of V-0. Its dielectric breakdown voltage is more than 5.0kV.
The new gap filler material is available in 210 x 297mm (8.3 x 11.7-in.) sheets or die-cut parts. Standard sheet thicknesses range from 0.5 to 5.0 mm (0.020 to 0.197-in.). An optional fiberglass liner is available on 0.5mm (0.020-in.) thick pads where added handling strength is needed.
Contact: MH&W International Corp., Thermal Products Division, 14 Leighton Place, Mahwah, NJ 07430
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