Save. Share. Connect.
Saturday, June 24, 2017
VOLUME -25 NUMBER 2
Publication Date: 02/1/2010
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Components and Distribution
Product Preview: Electronics West / MDM
February 2010 Issue
Add Message Board
Fujipoly: Thermal Interface Compound
Thermal interface compound.
Carteret, NJ — Fujipoly's Sarcon
SPG-30A is a newly developed high-viscosity, thermal interface silicone compound that is designed to efficiently transfer heat from a board-level source to a heat sink or heat spreader. This high-performance material offers a thermal conductivity of 3.2W/m°K and provides superior handling characteristics compared to traditional thermal grease and potting materials. The product also offers a new thermal management option for electronic devices that operate at higher frequencies.
The new compound exhibits near-zero compression force and easily conforms to all component shapes and sizes. These characteristics make the formulation suitable for filling large gaps around fragile circuit board solder points without causing damage or loss in performance. The form-stable thermal compound requires no heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range of -40 to +150°C).
The new material is available in 30cc tubes, 330cc cartridges and 10L pails.
Contact: Fujipoly America Corporation, P.O. Box 119, Carteret, NJ 07008
732-969-0100 fax: 732-969-3311 E-mail: email@example.com Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | firstname.lastname@example.org
powered by GIM