Thursday, June 30, 2016
VOLUME -25 NUMBER 2
Publication Date: 02/1/2010
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ARCHIVE >  February 2010 Issue >  Electronic Mfg. Products > 

Ascentech: GEN3 Solder Paste Analyzer
Solder paste analyzer.
Chester, CT — Ascentech LLC's SPA 1000 Solder Paste Analyzer tests to the recently-released SMART Group standard, SG PCT01, "Control of Solder Paste used in Electronic Assembly Process". The new analyzer provides, for the first time, a user-friendly test procedure that may be conducted in less than 1 hour, and is intended to help electronics assemblers determine the suitability of the solder paste prior to production. The tests show the actual useful life of the paste that will help to reduce waste and reduce environmental impact. The new standardized test is designed to eliminate multiple separate tests that would previously have been performed by separate instruments.

According to the company, the quality of a surface mount assembly process heavily depends on the condition of the solder paste. There has been a dramatically increased emphasis on process control testing by CEMs and ODMs who want to improve quality, increase process yields, and significantly reduce inspection and rework. The new analyzer is a sophisticated, multi-capable system that provides fast and accurate testing to the new SMART Group standard to help control and manage solder paste in the production process. The test methods used are adaptations of the methods employed by paste manufacturers found in IPC-TM-650, IPC J-STD004/5 and IEC 61189-5. The tests assess solder paste for Slump, Spread, Wetting, Tack, and Balling. Gathered data also provides the "Open Time" that the selected paste can provide to the user.

Contact: Ascentech, 127 Goose Hill Rd., Chester, CT 06412 860-526-8903 E-mail: rallinson@snet.net Web:
http://www.www.ascentechllc.com or www.gen3systems.com.

 
 
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