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Tuesday, September 26, 2017
VOLUME -25 NUMBER 2
Publication Date: 02/1/2010
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Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Components and Distribution
Product Preview: Electronics West / MDM
February 2010 Issue
Electronic Mfg. Products
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CAD-Based Hi-Res Coverage from phoenix|x-ray
microme|x with x|act for high-res, zero-defect x-ray inspection.
Wunstorf, Germany — x|act technology from phoenix|x-ray is part of the company's product line of GE Sensing & Inspection Technologies, and provides simple and intuitive CAD-based µAXI with very high image magnification. The technology provides for fully automatic x-ray inspection (AXI) of PCB assemblies with maximum defect coverage, precise image details with micrometer resolution, 360° rotation, oblique views at up to 70°, maximum positioning accuracy of just a few micrometers and reliable repeatability.
To keep programming time to a minimum, x|act imports the CAD data from the PCB to create a model, which facilitates navigation and also enables inspection strategies to be assigned to the individual components to be inspected. This is possible because inspection strategies with all the information required for inspection are already contained in the library for many common solder joints. After the inspection strategies have been assigned, the views required and inspection program are generated automatically. With CAD-based programming, all the programming steps can be performed offline at a separate workstation, meaning that the inspection system is not tied up during programming. It also means that every program can be transferred to every one of the company's x|act-capable systems. The CAD data can be viewed in the live image as an overlay at any time and from any viewing angle. This always enables quick and precise solder joint mapping even with manual inspection.
The x|act inspection technology is available on both nanome|x and microme|x x-ray inspection systems. The units have an open nanofocus or microfocus x-ray tube as standard with 180kV maximum tube voltage and 15 or 20W maximum power, achieving a detail detectability down to 200nm for the nanome|x and 0.5µm for the microme|x. The ultra-high-performance tube voltage and power ensure that even highly radiation-absorbent parts, such as heat sinks on PCBs, can be inspected. The specimen is manipulated using a calibrated, synchronized five-axis CNC machine that offers excellent repeatability.
An additional benefit of offline inspection is that, because the x-ray system is not connected to the production line, it can be used for simple manual inspections or CT-based 3D component analyses without disturbing production. Furthermore, the specimen is rotated through 360° during the process, permitting three-dimensional image to be generated from the series of 2D radioscopic images — which enables non-disruptive inspection and three-dimensional visualization of smaller specimens. The nanome|x, which incorporates the latest x|act software, even offers extremely high-resolution nanofocus computed tomography with Voxel resolution of just a few micrometers.
Contact: GE Sensing & Inspection Technologies GmbH, phoenix|x-ray, Niels-Bohr-Str. 7, 31515 Wunstorf,
+49 5031 172-103 fax: +49 5031 172-299 E-mail: email@example.com Web:
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