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Monday, October 24, 2016
VOLUME -24 NUMBER 12
Publication Date: 12/1/2009
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Special Features: Test and Measurement
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December 2009 Issue
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IMAPS Elects New President
IMAPS President-Elect Dr. Rajan Chanchani (right) of Sandia National Laboratories at IMAPS press luncheon (San Jose, CA) with Terrence Thompson, new executive editor of Wafer & Device Packaging and Interconnect.
Rajen Chanchani is currently a Principal Member of Technical Staff at Sandia National Laboratories, Albuquerque. He received Ph.D. and M.S. in Materials Science & Engineering from the University of Florida and received B. Tech. in Metallurgical Engineering from the Indian Institute of Technology, India.
At Sandia National Labs, he has managed packaging-related projects for the defense and non-defense applications since 1990.
Rajen is an IMAPS Fellow, IEEE Fellow and winner of 2004 IMAPS William D. Ashman Award for his work on new advanced packaging technologies. He is the recipient of the Best Conference Paper Award at the 1994 International Society of Hybrid Microelectronics Annual Conference in Boston and Micro-system 2005 in Munich, Germany, has several patents and has published over 80 papers at IMAPS, IEEE, and AIME sponsored conferences, publications and books. In addition, he has taught several short courses on advanced packaging topics at various conferences.
Rajen has been actively involved in IMAPS for last 16 years as a presenter at conferences, program committee member, William D. Ashman Award Search Committee member and organizer of IMAPS conferences.
Rajan was the Technical Chair of 2006 IMAPS Symposium in San Diego, General Chair (2002) and Program Chair (1994-95) for IMAPS-sponsored Advance Packaging Materials Conference in Ojai, Ca and Atlanta, GA.
The new president's track record with IMAPS activities, his work experience and enthusiasm for the advancement of packaging technologies will be a valuable asset for IMAPS leadership.
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