2nd Advanced Technology Workshop on Automotive Microelectronics and Packaging
Doubletree Hotel Dearborn, Michigan - USAApril 28-30, 2010 Abstract Deadline - November 30, 2009
Automotive electronic content continues to rise in vehicles every year. As content rises, microelectronic packaging will continue to play a larger role, as the automobile industry drives for electronics that are smaller in size, lower in cost, higher in content, and more reliable in harsh environments. This Advanced Technology Workshop (ATW) is focused, solely, on advanced developments in automotive electronic packaging. We are looking for presentations on advanced technologies that are pushing the envelope of automotive packaging, in the areas of systems & applications, design, and materials & processes. Your presentation may cover an advanced technology that you have or an advanced technology you need.
International Conference on High Temperature Electronics
(HiTEC 2010) May 11-13, 2010
Hyatt Regency,330 Tijeras NW, Albuquerque, New Mexico 87102 Abstract Deadline - November 30, 2009