Manassas, VA –
As microelectronic components have become progressively smaller and board densities continue to increase, electronic assemblies will be even more difficult to clean. The penetration level of the cleaning agent can be directly correlated to the geometry and height of the components in question. Studies have shown that the removal of flux residues from under low standoff components, which are now showing a clearance of less than 1 mil, as well as the emergence of lead-free solder pastes are presenting tremendous challenges to the high precision cleaning industry and posing important questions.
What is the key to removing flux residues under low standoff components? How do you achieve perfect cleaning results in the smallest spaces and in turn guarantee component reliability?
In order to answer these questions and learn how to meet and overcome the latest industry challenges, ZESTRON America, the global leader in high precision cleaning products and services, will present “Reliable Cleaning Under Low Standoffs” during the SMTA South East Asia Technical Conference on Electronics Assembly Technologies held at the Equatorial Hotel Penang, Bayan Lepas, Penang, Malaysia, November 19 - 20, 2009. Please join ZESTRON America’s Senior Process Engineer, Ravi Parthasarathy, in session 4 on November 19th from 3:30pm until 5:00pm.
To register for the conference, please visit
www.smta.org.
For more information about ZESTRON products, services and complementary samples, please visit www.zestron.com.